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Adhesive Materials & TDS
Appli-Tec offers a broad range of pre-mixed and frozen (PMF) and 2-part adhesive materials, which you can see listed in the chart below.
In addition to our own adhesive product line, we package materials by manufacturers such as 3M, Dow Corning and Henkel. Please view our Manufacturers List and then contact us at service@appli-tec.com if you need an adhesive material packaged.
If you don’t see an adhesive material suitable for your application and need one custom developed, please see our Custom Material Development page.
Over 95% of Appli-Tec’s adhesive products are solvent-free.
Use the filter tools below to help you choose a material by property or application type.
| Product | Two-part Kit | Category | Material Type | Low Outgas E595 | Viscosity (cps) | Shore Hardness | Lap Shear 2024T3 Clad FPL Etch (psi) | Volume Resistivity (ohm-cm) | Pot Life (hrs) | Data sheets (PDF) | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 6207 | PMF Only | Low Coefficient of Thermal Expansion | UV Acrylate | Yes | 35,000 | D/94/0 | 1,500 | >1.0E+12 | 18.0 | TDS, SDS | Bonding |
| 0121 | PMF Only | Electrically Conductive | Epoxy | Not Tested | 2,150 | D/80/0 | 1,500 | 6.0E-4 | 48 | TDS, SDS | Bonding |
| 5200 | Yes | Electrically Conductive, 2.5 | Epoxy | Yes | Paste | D/90/0 | 1,200 | 2e-3 | 0.5 | TDS, SDS | Bonding |
| 5302 | PMF Only | Thermally Conductive, 1.85 W/mK | Epoxy | Yes | 125,000 | D/97/0 | 2,500 | 2.13E+16 | 4.0 | TDS, SDS | Bonding, Potting |
| 5308 | Yes | Thermally Conductive, 1.26 W/mK | Epoxy | Yes | 100,000 | D/90/0 | 2,000 | 4.0E+15 | 3.0 | TDS, SDS | Staking, Potting, Encapsulation |
| 5336 | Yes | Thermally Conductive, 1.48 W/mK | Epoxy | Yes | 39,500 | D/93/0 | 2,040 | 3.5E+15 | 1.5 | TDS, SDS | Staking, Potting, Encapsulation |
| 0543 | Yes | Thermally Conductive, 0.7 W/mK | Polysulfide | No | Paste | A/55/0 | 400 | >1.0E+12 | 2.0 | TDS, SDS | Bonding, Staking |
| 0720 | Yes | Thermally Conductive, 0.8 W/mK | Polysulfide | No | Paste | A/70/0 | 350 | >1.0E+12 | 2.0 | TDS, SDS | Bonding, Staking |
| 0709 | PMF Only | Thermally Conductive, 0.9 W/mK | Urethane | No | Paste | A/88/0 | 750 | 1.0E+14 | 1.5 | TDS, SDS | Bonding, Staking |
| 7300 | PMF Only | Thermally Conductive, 2.5 W/mK | Urethane | Yes | Paste | D/45/0 | 500 | 1.0E+13 | 4.0 | TDS, SDS | Bonding, Potting |
| 7308 | PMF Only | Thermally Conductive, 1.11 W/mK | Urethane | Yes | Paste | A/86/0 | 300 | 1.0E+14 | 8.0 | TDS, SDS | Bonding, Staking, Potting, Encapsulation |
| 7340 | PMF Only | Thermally Conductive, 1.0 W/mK | Urethane | Yes | Paste | D/45/0 | 1,300 | 1.0E+15 | 1.5 | TDS, SDS | Bonding, Staking |
| 0161 | PMF Only | Insulative/Low Thermal Conductivity | Epoxy | Yes | 55,000 | D/88/0 | 3,500 | 1.0E+15 | 1.0 | TDS, SDS | Bonding, Staking |
| 0176 | Yes | Insulative/Low Thermal Conductivity | Epoxy | Yes | 55,000 | D/70/0 | 3,500 | 1.0E+15 | 1.25 | TDS, SDS | Bonding, Staking |
| 5010 | Yes | Insulative/Low Thermal Conductivity | Epoxy | Yes | 5,000 | D/85/0 | 2,500 | 4.7E+16 | 7.0 | TDS, SDS | Bonding |
| 5018 | Yes | Insulative/Low Thermal Conductivity | Epoxy | No | 3,000 | D/88/0 | 3,000 | 9.7E+14 | 3.0 | TDS, SDS | Bonding |
| 5051 | Yes | Insulative/Low Thermal Conductivity | Epoxy | Yes | 320 | D/83/0 | 3,300 | 1.7E+16 | 4.0 | TDS, SDS | Bonding, Potting |
| 5108 | Yes | Insulative/Low Thermal Conductivity | Epoxy | Yes | 5,000 | D/80/0 | 3,000 | 7.0E+13 | 2.0 | TDS, SDS | Bonding, Potting |
| 0148 | PMF Only | Insulative/Low Thermal Conductivity | Polysulfide | Not Tested | Paste | A/51/0 | N/A | >1.0E+12 | 2.0 | TDS, SDS | Bonding, Staking |
| 0278 | PMF Only | Insulative/Low Thermal Conductivity | Urethane | Yes | 9,500 | A/55/0 | 400 | 1.0E+15 | 0.25 | TDS, SDS | Bonding |
| 0308 | PMF Only | Insulative/Low Thermal Conductivity | Urethane | Yes | 80,000 | A/60/0 | 1,000 | 1.0E+15 | 0.25 | TDS, SDS | Bonding, Staking, Encapsulation |
| 0316 | PMF Only | Insulative/Low Thermal Conductivity | Urethane | Yes | Paste | A/70/0 | 800 | 1.0E+15 | 0.25 | TDS, SDS | Bonding, Staking |
| 7125 | Yes | Insulative/Low Thermal Conductivity | Urethane | Yes | 2,850 | A/70/0 | 500 | 4.0E+15 | 0.75 | TDS, SDS | Bonding, Potting, Encapsulation |
| 7800 | PMF Only | Insulative/Low Thermal Conductivity | Urethane | Yes | Paste | A/65/0 | 500 | 1.0E+13 | 1.5 | TDS, SDS | Bonding, Staking |
| 7810 | PMF Only | Insulative/Low Thermal Conductivity | Urethane | Yes | 6,400 | A/65/0 | 400 | 2.0E+13 | 1.5 | TDS, SDS | Potting, Encapsulation |
| 6007 | PMF Only | Insulative/Low Thermal Conductivity | UV Acrylate | Yes | 1,300 | D/85/0 | 2,300 | >1.0E+12 | 18.0 | TDS, SDS | Bonding |
| 0798 | PMF Only | Supported Epoxy Film | Epoxy | Not Tested | N/A | N/A | 5,000 | >1.0E+12 | 120 | TDS, SDS | Bonding |
| 0676 | N/A | Low Density Casting | Epoxy | Not Tested | N/A | D/83/0 | N/A | >1.0E+12 | N/A | TDS, SDS | |
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