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Adhesive Materials & TDS
Use the filter tools below to help you choose a material by property or application type.
| Product | Material Type | Storage | Thermal Conductivity (W/mK) | Electrical Properties | Low Outgas E595 | Pot Life (hrs) | Viscosity Mixed (cps) |
Shore Hardness | Lap Shear 2024T3 Clad FPL Etch (psi) | Data sheets (PDF) | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 5390 | Epoxy | Cryogenic | 4.3 W/mK | Electrically Insulative | Yes | 6.0 | Paste | D/90/0 | 1,130 | TDS, SDS | Bonding |
| 5380 | Epoxy | Cryogenic | 3.2 W/mK | Electrically Insulative | Yes | 6.0 | 44,000 | D/90/0 | 1,775 | TDS, SDS | Bonding, Potting, Encapsulation |
| 5327 | Epoxy | Cryogenic AND Room Temp | 2.6 W/mK | Electrically Insulative | Yes | 6.0 | 46,400 | D/90/0 | 2,170 | TDS, SDS | Bonding, Potting |
| 7300 | Urethane | Cryogenic | 2.5 W/mK | Electrically Insulative | Yes | 4.0 | Paste | D/45/0 | 500 | TDS, SDS | Bonding, Potting, Encapsulation |
| 7330 | Urethane | -20°C | 2.5 W/mK | Electrically Insulative | Yes | 4.0 | Paste | D/50/0 | 445 | TDS, SDS | Bonding, Potting, Encapsulation |
| 5336 | Epoxy | Cryogenic AND Room Temp | 1.48 W/mK | Electrically Insulative | Yes | 1.5 | 21,000 | D/93/0 | 2,040 | TDS, SDS | Staking, Potting, Encapsulation |
| 5340 | Epoxy | Room Temp | 1.0 W/mK | Electrically Insulative | Yes | 1.5 | 120,000 | D/90/0 | 2,400 | TDS, SDS | Bonding, Staking, Potting, Encapsulation |
| 7340 | Urethane | Cryogenic | 1.0 W/mK | Electrically Insulative | Yes | 1.5 | Paste | D/45/0 | 1,300 | TDS, SDS | Bonding, Staking |
| 0709 | Urethane | Cryogenic | 0.9 W/mK | Electrically Insulative | No | 1.5 | Paste | A/88/0 | 750 | TDS, SDS | Staking |
| 7308 | Urethane | Cryogenic | 1.11 W/mK | Electrically Insulative | Yes | 8.0 | Paste | A/86/0 | 300 | TDS, SDS | Bonding, Potting, Encapsulation |
| 7800 | Urethane | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 1.5 | Paste | A/65/0 | 500 | TDS, SDS | Bonding, Staking |
| 7810 | Urethane | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 1.5 | 6,400 | A/65/0 | 400 | TDS, SDS | Potting, Encapsulation |
| 7125 | Urethane | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | Yes | 0.75 | 2,850 | A/70/0 | 500 | TDS, SDS | Bonding, Potting, Encapsulation |
| 0308 | Urethane | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 0.25 | 80,000 | A/60/0 | 1,000 | TDS, SDS | Staking |
| 0316 | Urethane | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 0.25 | Paste | A/70/0 | 800 | TDS, SDS | Staking |
| 7135 | Urethane | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | Yes | 0.75 | 10,000 | A/70/0 | 700 | TDS, SDS | Bonding, Potting, Encapsulation |
| 0278 | Urethane | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 0.25 | 9,500 | A/55/0 | 400 | TDS, SDS | Staking |
| 5010 | Epoxy | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | Yes | 7.0 | 5,000 | D/85/0 | 2,500 | TDS, SDS | Bonding |
| 5032 | Epoxy | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | No | 1.25 | 600 | D/85/0 | 4,160 | TDS, SDS | Bonding, Potting, Encapsulation |
| 5051 | Epoxy | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | Yes | 4.0 | 320 | D/83/0 | 3,300 | TDS, SDS | Bonding, Potting, Encapsulation |
| 0176 | Epoxy | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | Yes | 1.25 | 55,000 | D/70/0 | 3,500 | TDS, SDS | Bonding, Staking |
| 5108 | Epoxy | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | Yes | 2.0 | 5,000 | D/80/0 | 3,000 | TDS, SDS | Bonding, Potting, Encapsulation |
| 5018 | Epoxy | Cryogenic AND Room Temp | <0.3 W/mK | Electrically Insulative | No | 3.0 | 3,000 | D/88/0 | 3,000 | TDS, SDS | Bonding, Potting, Encapsulation |
| 0161 | Epoxy | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 1.0 | 55,000 | D/88/0 | 3,500 | TDS, SDS | Bonding, Staking |
| 5302 | Epoxy | Cryogenic | 1.85 W/mK | Electrically Insulative | Yes | 4.0 | 125,000 | D/97/0 | 2,500 | TDS, SDS | Bonding, Potting, Encapsulation |
| 5070 | Epoxy | Cryogenic | <0.3 W/mK | Electrically Isolating | Yes | 3.0 | 640 | D/85/0 | 4,340 | TDS, SDS | Bonding, Potting, Encapsulation |
| 6207 | UV Acrylate | Cryogenic | Low Coefficient of Thermal Expansion | Electrically Insulative | Yes | 18.0 | 35,000 | D/94/0 | 1,500 | TDS, SDS | Bonding |
| 6007 | UV Acrylate | Cryogenic | <0.3 W/mK | Electrically Insulative | Yes | 18.0 | 1,300 | D/85/0 | 2,300 | TDS, SDS | Bonding |
| 6120 | UV Acrylate | Room Temp | <0.3W/mK | Electrically Isolating | No | N/A | 1,400 | D/82/0 | N/A | TDS, SDS | Bonding, Potting |
| 0148 | Polysulfide | Cryogenic | <0.3 W/mK | Electrically Insulative | No | 2.0 | Paste | A/51/0 | N/A | TDS, SDS | Staking |
| 0543 | Polysulfide | Cryogenic AND Room Temp | 0.7 W/mK | Electrically Insulative | No | 2.0 | Paste | A/55/0 | 400 | TDS, SDS | Staking |
| 0720 | Polysulfide | Cryogenic AND Room Temp | 0.8 W/mK | Electrically Insulative | No | 2.0 | Paste | A/70/0 | 350 | TDS, SDS | Staking |
| 5200 | Epoxy | Cryogenic AND Room Temp | 2.5 W/mK | Electrically Conductive | Yes | 0.5 | Paste | D/90/0 | 1,200 | TDS, SDS | Bonding, Staking |
| 5230 | Epoxy | Cryogenic AND Room Temp | 1.75 W/mK | Electrically Conductive | Yes | 1.5 | Paste | D/85/0 | 1,165 | TDS, SDS | Bonding |
| 0121 | Epoxy | Cryogenic | 2.2 W/mK | Electrically Conductive | No | 48 | 2,150 | D/80/0 | 1,500 | TDS, SDS | Bonding |
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