Adhesive Materials & TDS

Use the filter tools below to help you choose a material by property or application type.

Product Material Type Storage Thermal Conductivity (W/mK) Electrical Properties Low Outgas E595 Pot Life (hrs) Viscosity (cps) Shore Hardness Lap Shear 2024T3 Clad FPL Etch (psi) Data sheets (PDF) Applications
5390EpoxyCryogenic4.3 W/mKElectrically InsulativeYes6.0PasteD/90/01,130TDS, SDSBonding
7300UrethaneCryogenic2.5 W/mKElectrically InsulativeYes4.0PasteD/45/0500TDS, SDSBonding, Potting
5336EpoxyCryogenic
AND
Room Temp
1.48 W/mKElectrically InsulativeYes1.539,500D/93/02,040TDS, SDSStaking, Potting, Encapsulation
7340UrethaneCryogenic1.0 W/mKElectrically InsulativeYes1.5PasteD/45/01,300TDS, SDSBonding, Staking
0709UrethaneCryogenic0.9 W/mKElectrically InsulativeNo1.5PasteA/88/0750TDS, SDSBonding, Staking
7308UrethaneCryogenic1.11 W/mKElectrically InsulativeYes8.0PasteA/86/0300TDS, SDSBonding, Staking, Potting, Encapsulation
7800UrethaneCryogenic<0.3 W/mKElectrically InsulativeYes1.5PasteA/65/0500TDS, SDSBonding, Staking
7810UrethaneCryogenic<0.3 W/mKElectrically InsulativeYes1.56,400A/65/0400TDS, SDSPotting, Encapsulation
7125UrethaneCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeYes0.752,850A/70/0500TDS, SDSBonding, Potting, Encapsulation
0308UrethaneCryogenic<0.3 W/mKElectrically InsulativeYes0.2580,000A/60/01,000TDS, SDSBonding, Staking, Encapsulation
0316UrethaneCryogenic<0.3 W/mKElectrically InsulativeYes0.25PasteA/70/0800TDS, SDSBonding, Staking
7135UrethaneCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeYes0.7510,000A/70/0700TDS, SDSBonding, Potting, Encapsulation
0278UrethaneCryogenic<0.3 W/mKElectrically InsulativeYes0.259,500A/55/0400TDS, SDSBonding
5010EpoxyCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeYes7.05,000D/85/02,500TDS, SDSBonding
5051EpoxyCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeYes4.0320D/83/03,300TDS, SDSBonding, Potting
0176EpoxyCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeYes1.2555,000D/70/03,500TDS, SDSBonding, Staking
5108EpoxyCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeYes2.05,000D/80/03,000TDS, SDSBonding, Potting
5018EpoxyCryogenic
AND
Room Temp
<0.3 W/mKElectrically InsulativeNo3.03,000D/88/03,000TDS, SDSBonding
0161EpoxyCryogenic<0.3 W/mKElectrically InsulativeYes1.055,000D/88/03,500TDS, SDSBonding, Staking
5302EpoxyCryogenic1.85 W/mKElectrically InsulativeYes4.0125,000D/97/02,500TDS, SDSBonding, Potting
6207UV AcrylateCryogenicLow Coefficient of Thermal ExpansionElectrically InsulativeYes18.035,000D/94/01,500TDS, SDSBonding
6007UV AcrylateCryogenic<0.3 W/mKElectrically InsulativeYes18.01,300D/85/02,300TDS, SDSBonding
0148PolysulfideCryogenic<0.3 W/mKElectrically InsulativeNo2.0PasteA/51/0N/ATDS, SDSBonding, Staking
0543PolysulfideCryogenic
AND
Room Temp
0.7 W/mKElectrically InsulativeNo2.0PasteA/55/0400TDS, SDSBonding, Staking
0720PolysulfideCryogenic
AND
Room Temp
0.8 W/mKElectrically InsulativeNo2.0PasteA/70/0350TDS, SDSBonding, Staking
5200EpoxyCryogenic
AND
Room Temp
2.5 W/mKElectrically ConductiveYes0.5PasteD/90/01,200TDS, SDSBonding
0121EpoxyCryogenic2.2 W/mKElectrically ConductiveNo482,150D/80/01,500TDS, SDSBonding

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