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Adhesive Materials & TDS
Appli-Tec offers a broad range of adhesive materials, which you can see listed in the chart below. If you don’t see an adhesive material suitable for your application and need one custom developed, please see our Custom Material Development page.
In addition to our own adhesive product line, we package materials by manufacturers such as 3M, Dow Corning and Henkel. Please view our Manufacturers List and then contact us at service@appli-tec.com if you need an adhesive material packaged.
Over 95% of Appli-Tec’s adhesive products are solvent-free.
| Product | Category | Material Type | Low Outgas E595 | Viscosity (cps) | Shore Hardness | Lap Shear 2024T3 Clad FPL Etch (psi) | Volume Resistivity (ohm-cm) | Pot Life (hrs) | Data sheets (PDF) | Applications |
|---|---|---|---|---|---|---|---|---|---|---|
| 6207 | Low Coefficient of Thermal Expansion | UV Acrylate | Yes | 35,000 | D/94/0 | 1,500 | >1.0E+12 | 18.0 | TDS, SDS | Bonding |
| 0121 | Electrically Conductive | Epoxy | Not Tested | 2,150 | D/80/0 | 1,500 | 6.0E-4 | 48 | TDS, SDS | Bonding |
| 5200 | Electrically Conductive, 2.5 | Epoxy | Yes | Paste | D/90/0 | 1,200 | 2e-3 | 0.5 | TDS, SDS | Bonding |
| 5302 | Thermally Conductive, 1.85 W/mK | Epoxy | Yes | 125,000 | D/97/0 | 2,500 | 2.13E+16 | 4.0 | TDS, SDS | Bonding, Potting |
| 5308 | Thermally Conductive, 1.26 W/mK | Epoxy | Yes | 100,000 | D/90/0 | 2,000 | 4.0E+15 | 3.0 | TDS, SDS | Staking, Potting, Encapsulation |
| 5336 | Thermally Conductive, 1.48 W/mK | Epoxy | Yes | 39,500 | D/93/0 | 2040 | 3.5E+15 | 1.5 | TDS, SDS | Staking, Potting, Encapsulation |
| 0543 | Thermally Conductive, 0.7 W/mK | Polysulfide | No | Paste | A/55/0 | 400 | >1.0E+12 | 2.0 | TDS, SDS | Bonding, Staking |
| 0720 | Thermally Conductive, 0.8 W/mK | Polysulfide | No | Paste | A/70/0 | 350 | >1.0E+12 | 2.0 | TDS, SDS | Bonding, Staking |
| 0709 | Thermally Conductive, 0.9 W/mK | Urethane | No | Paste | A/88/0 | 750 | 1.0E+14 | 1.5 | TDS, SDS | Bonding, Staking |
| 7300 | Thermally Conductive, 2.5 W/mK | Urethane | Yes | Paste | D/45/0 | 500 | 1.0E+13 | 4.0 | TDS, SDS | Bonding, Potting |
| 7308 | Thermally Conductive, 1.11 W/mK | Urethane | Yes | Paste | A/86/0 | 300 | 1.0E+14 | 8.0 | TDS, SDS | Bonding, Staking, Potting, Encapsulation |
| 7340 | Thermally Conductive, 1.0 W/mK | Urethane | Yes | Paste | D/45/0 | 1,300 | 1.0E+15 | 1.5 | TDS, SDS | Bonding, Staking |
| 0161 | Insulative/Low Thermal Conductivity | Epoxy | Yes | 55,000 | D/88/0 | 3,500 | 1.0E+15 | 1.0 | TDS, SDS | Bonding, Staking |
| 0176 | Insulative/Low Thermal Conductivity | Epoxy | Yes | 55,000 | D/70/0 | 3,500 | 1.0E+15 | 1.25 | TDS, SDS | Bonding, Staking |
| 5010 | Insulative/Low Thermal Conductivity | Epoxy | Yes | 5,000 | D/85/0 | 2,500 | 4.7E+16 | 7.0 | TDS, SDS | Bonding |
| 5018 | Insulative/Low Thermal Conductivity | Epoxy | No | 3,000 | D/88/0 | 3,000 | 9.7E+14 | 3.0 | TDS, SDS | Bonding |
| 5051 | Insulative/Low Thermal Conductivity | Epoxy | Yes | 320 | D/83/0 | 3,300 | 1.7E+16 | 4.0 | TDS, SDS | Bonding, Potting |
| 5108 | Insulative/Low Thermal Conductivity | Epoxy | Yes | 5,000 | D/80/0 | 3,000 | 7.0E+13 | 2.0 | TDS, SDS | Bonding, Potting |
| 0148 | Insulative/Low Thermal Conductivity | Polysulfide | Not Tested | Paste | A/51/0 | N/A | >1.0E+12 | 2.0 | TDS, SDS | Bonding, Staking |
| 0278 | Insulative/Low Thermal Conductivity | Urethane | Yes | 9,500 | A/55/0 | 400 | 1.0E+15 | 0.25 | TDS, SDS | Bonding |
| 0308 | Insulative/Low Thermal Conductivity | Urethane | Yes | 80,000 | A/60/0 | 1,000 | 1.0E+15 | 0.25 | TDS, SDS | Bonding, Staking, Encapsulation |
| 0316 | Insulative/Low Thermal Conductivity | Urethane | Yes | Paste | A/70/0 | 800 | 1.0E+15 | 0.25 | TDS, SDS | Bonding, Staking |
| 7125 | Insulative/Low Thermal Conductivity | Urethane | Yes | 2,850 | A/70/0 | 500 | 4.0E+15 | 0.75 | TDS, SDS | Bonding, Potting, Encapsulation |
| 7800 | Insulative/Low Thermal Conductivity | Urethane | Yes | Paste | A/65/0 | 500 | 1.0E+13 | 1.5 | TDS, SDS | Bonding, Staking |
| 7810 | Insulative/Low Thermal Conductivity | Urethane | Yes | 6,400 | A/65/0 | 400 | 2.0E+13 | 1.5 | TDS, SDS | Potting, Encapsulation |
| 6007 | Insulative/Low Thermal Conductivity | UV Acrylate | Yes | 1,300 | D/85/0 | 2,300 | >1.0E+12 | 18.0 | TDS, SDS | Bonding |
| 0798 | Supported Epoxy Film | 12 mil thick | Not Tested | N/A | N/A | 5,000 | >1.0E+12 | 120 | TDS, SDS | Bonding |
| 0676 | Low Density Casting | Epoxy | Not Tested | N/A | D/83/0 | N/A | >1.0E+12 | N/A | TDS, SDS | |
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