Adhesive Materials & TDS

Appli-Tec offers a broad range of adhesive materials, which you can see listed in the chart below. If you don’t see an adhesive material suitable for your application and need one custom developed, please see our Custom Material Development page.

In addition to our own adhesive product line, we package materials by manufacturers such as 3M, Dow Corning and Henkel. Please view our Manufacturers List and then contact us at service@appli-tec.com if you need an adhesive material packaged.

Product Category Material Type Low Outgas E595 Viscosity (cps) Shore Hardness Lap Shear 2024T3 Clad FPL Etch (psi) Volume Resistivity (ohm-cm) Pot Life (hrs) Data sheets (PDF) Applications
6207Low Coefficient of Thermal ExpansionUV AcrylateYes35,000D/94/01,500>1.0E+1218.0TDS, SDSBonding
0121Electrically ConductiveEpoxyNot Tested2,150D/80/01,5006.0E-448TDS, SDSBonding
5200Electrically ConductiveEpoxyYesPasteD/90/01,2002e-30.5TDS, SDSBonding
5302Thermally Conductive, 1.85 W/mKEpoxyYes125,000D/97/02,5002.13E+164.0TDS, SDSBonding, Potting
5308Thermally Conductive, 1.26 W/mKEpoxyYes100,000D/90/02,0004.0E+153.0TDS, SDSStaking, Potting, Encapsulation
5336Thermally Conductive, 1.48 W/mKEpoxyYes39,500D/93/020403.5E+151.5TDS, SDSStaking, Potting, Encapsulation
5316Thermally Conductive, 1.38 W/mKEpoxyYes12,500D/85/02,5002.25E+151.5TDS, SDSStaking, Potting, Encapsulation
0543Thermally Conductive, 0.7 W/mKPolysulfideNoPasteA/55/0400>1.0E+122.0TDS, SDSBonding, Staking
0720Thermally Conductive, 0.8 W/mKPolysulfideNoPasteA/70/0350>1.0E+122.0TDS, SDSBonding, Staking
0709Thermally Conductive, 0.9 W/mKUrethaneNoPasteA/88/07501.0E+141.5TDS, SDSBonding, Staking
7300Thermally Conductive, 2.5 W/mKUrethaneYesPasteD/45/05001.0E+134.0TDS, SDSBonding, Potting
7308Thermally Conductive, 1.11 W/mKUrethaneYesPasteA/86/03001.0E+148.0TDS, SDSBonding, Staking, Potting, Encapsulation
7340Thermally Conductive, 1.0 W/mKUrethaneYesPasteD/45/01,3001.0E+151.5TDS, SDSBonding, Staking
0161Insulative/Low Thermal ConductivityEpoxyYes55,000D/88/03,5001.0E+151.0TDS, SDSBonding, Staking
0176Insulative/Low Thermal ConductivityEpoxyYes55,000D/70/03,5001.0E+151.25TDS, SDSBonding, Staking
5010Insulative/Low Thermal ConductivityEpoxyYes5,000D/85/02,5004.7E+167.0TDS, SDSBonding
5018Insulative/Low Thermal ConductivityEpoxyNo3,000D/88/03,0009.7E+143.0TDS, SDSBonding
5051Insulative/Low Thermal ConductivityEpoxyYes320D/83/03,3001.7E+164.0TDS, SDSBonding, Potting
5108Insulative/Low Thermal ConductivityEpoxyYes5,000D/80/03,0007.0E+132.0TDS, SDSBonding, Potting
0148Insulative/Low Thermal ConductivityPolysulfideNot TestedPasteA/51/0N/A>1.0E+122.0TDS, SDSBonding, Staking
0278Insulative/Low Thermal ConductivityUrethaneYes9,500A/55/04001.0E+150.25TDS, SDSBonding
0308Insulative/Low Thermal ConductivityUrethaneYes80,000A/60/01,0001.0E+150.25TDS, SDSBonding, Staking, Encapsulation
0316Insulative/Low Thermal ConductivityUrethaneYesPasteA/70/08001.0E+150.25TDS, SDSBonding, Staking
7125Insulative/Low Thermal ConductivityUrethaneYes2,850A/70/05004.0E+150.75TDS, SDSBonding, Potting, Encapsulation
7800Insulative/Low Thermal ConductivityUrethaneYesPasteA/65/05001.0E+131.5TDS, SDSBonding, Staking
7810Insulative/Low Thermal ConductivityUrethaneYes6,400A/65/04002.0E+131.5TDS, SDSPotting, Encapsulation
6007Insulative/Low Thermal ConductivityUV AcrylateYes1,300D/85/02,300>1.0E+1218.0TDS, SDSBonding
0798Supported Epoxy Film12 mil thickNot TestedN/AN/A5,000>1.0E+12120TDS, SDSBonding
0676Low Density CastingEpoxyNot TestedN/AD/83/0N/A>1.0E+12N/ATDS, SDS

No materials found. Please adjust the filters above.

How to get started

Whether you need a quote or you have questions about material availability, we can help.

Appli-Tec Customer Support

Super smart adhesive info for engineers by engineers.

Plus a little humor too. Delivered to your inbox once a month.