Appli-Tec’s 5390 Epoxy is very thermally conductive, electrically insulative, and silver-free.
The impact of mix ratio on adhesive performance is critical and impacts everything from cure rate to outgassing properties.
Temperature and humidity greatly affect viscosity, pot life, adhesive performance, and cured properties.
CEO Tim Walsh’s thoughts on Appli-Tec’s 40th anniversary — and how the company has transformed over the last three years.
Appli-Tec has had 100% traceability for decades. If you’re ever audited, we can tell you who did what, when, where, and how.
How the Appli-Tec team reduced the amount of trash by 90%.
The type of adhesive cure to use depends on your application, what you’re trying to achieve, and your time frame.
95% of our product line is solvent-free – meaning the materials aren’t flammable or have very low VOC emission.
With continued innovations, Appli-Tec can “weather” a two-week power outage — ensuring on-time delivery of PMF adhesive materials.
Learn why bonding components to PCBs is different than metal-to-metal bonding (e.g. aluminum to aluminum).
Appli-Tec thermally conductive adhesives eliminate the three challenges associated with thermal grease and pads for heat sink applications.
The key difference between potting and encapsulation explained.