5340 Epoxy

Thermally conductive, two-part epoxy packaged in 1:1 cartridges

5340 is designed for potting and bonding applications that require thermal conductivity and high lap-shear strength. Conveniently packaged in easy-to-use cartridges, 5340 meets NASA outgas standards for high reliability electronics and aerospace applications.

Uncured

Pot Life @ 25°C90 Minutes
Viscosity, Part A, @ 25°C115,000 cPs
Viscosity, Part B, @ 25°C140,000 cPs
Viscosity, Mixed, @ 25°C120,000 cPs
Thixotropic Index1.6
Shelf Life @ 15-25°C6 Months from Date of Shipment
Mix Ratio A:B100:100 Parts By Volume

Cured Options

2 hours @ 80°C 24 hrs @ 25°C (Handling) 7 Days @ 25°C (Full Cure)

Cured Properties

Based on cure of 2 hours @ 80°C

ColorOff-White
Shore D Hardness90
Glass Transition Temp (°C)70
Density (g/cc)2.19
Lap Shear (psi)2400

Electrical Properties

Based on cure of 2 hours @ 80°C

Dielectric Constant, 1MHz4.44
Dissipation Factor, 1MHz0.013
Dielectric Strength (volts/mil)550
Volume Resistivity (ohm-cm)1.7E+15@ 500 VDC

Thermal Properties

Based on cure of 2 hours @ 80°C

Glass Transition Temp (°C)70
Thermal Conductivity (W/mK)1
Operating Temperature (°C)-50 to 150

Outgassing Properties

Based on cure of 2 hours @ 80°C

TML (%)0.42
CVCM (%)0.02
WVR (%)0.16

Acoustic Properties

Velocity (m/s)2909
Impedance (MRayls)6.369
Loss (dB/cm-MHz)-9.41
Density (g/cc)2.19

Key Features

  • Electrically Isolating
  • Thermally Conductive
  • Convenient Mix Ratio
  • Flowable
  • √ RoHS Compliant

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev B
3-7-24

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