0308 Urethane Adhesive

Space flight grade; designed specifically for encapsulation

0308 is an opaque amber, one-component, precision mixed, degassed, and frozen, electrically isolating, Space Flight Grade urethane adhesive designed specifically for encapsulation with highly reliable dispensing. This material has a thixotropic consistency but will exhibit limited flow upon application. 0308 exhibits low thermal conductivity and can be cured at either room or elevated temperatures. It will bond well to most substrates such as metals, glass, ceramics, and most plastics. This material meets the NASA outgassing requirements with a TML of 0.69% and a CVCM of <0.01%. The material meets NASA's outgassing requirements.

Uncured

Work Life @ 25°C30 minutes
Pot Life @ 25°C15 minutes
Viscosity @ 25°C80,000 cPs
Shelf Life3 weeks @ -40°C 3 months @ -60°C TBD @ -75°C

Cure Options

8 hours @ 93°C 7 days @ 25°C 24 hours @ 23°C + 16 hours @ 65°C

Cured Properties

Based on cure of 8 hours @ 93°C

ColorOpaque Amber
Shore A Hardness60
Glass Transition Temp (°C)-70
Density (g/cc)0.99
Lap Shear 2024T3 Clad (psi)1000

Electrical Properties

Based on cure of 24 hours @ 23°C + 16 hours @ 65°C

Volume Resistivity (ohm-cm)4.1 E 14 @ 500 VDC

Thermal Properties

Based on cure of 24 hours @ 23°C + 16 hours @ 65°C

CTE above Tg (ppm/°C)204
CTE below Tg (ppm/°C)Not Determined
Glass Transition Temp (°C)-76
Operating Temp. Range (°C)-100 to 130

Outgassing Properties

Based on cure of 24 hours @ 23°C + 16 hours @ 65°C

TML (%)0.63
CVCM (%)<0.01
WVR (%)0.07

Outgassing Properties

Based on cure of 9 hours @ 65°C

TML (%)0.69
CVCM (%)<0.01
WVR (%)0.09

Acoustic Properties

Velocity (m/s)1,609
Impedance (MRayls)1.591
Loss (dB/cm-MHz)-6.0
Density (g/cc)0.99

Key Features

  • Bonds Well to Most Substrates
  • Electrically Isolating
  • Thixotropic Consistency
  • Room or Elevated Temperature Cure
  • Space Flight Grade
  • User-friendly Packaging
  • Meets NASA Outgassing Requirements

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev F
11/8/2023

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