5108 Epoxy

Self-leveling, withstands high humidity environments

5108 is a black, electrically isolating epoxy adhesive specifically designed for potting and sealing electronic components. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. This material is also environmentally friendly and considered non‐hazardous per D.O.T. regulations. 5108 is available in one-part pre-mixed and frozen syringes and two-part room temperature stable kits.

Uncured

Pot Life @ 25°C2 hours
Viscosity, Part A @25°C2,100 cPs
Viscosity, Part B @25°C11,000 cPs
Viscosity, mixed @ 25°C5,000 cPs
Shelf Life, PMF@ ‐40°C 6 Months
Shelf Life, 2-Part Kit@18°C to 25°C 12 Months
Mix Ratio100A to 51.75B parts by weight

Cure Options

1 hour @ 92°C 4 hours @ 65°C 48 hours @ 25°C

Cured Properties

Based on cure of 4 hours @ 65°C

ColorBlack
Shore D Hardness80
Lap Shear (psi)3500
Density (g/cc)1.07
Glass Transition Temp (°C)45
Shrinkage Linear (%)0.26

Electrical Properties

Based on cure of 4 hours @ 65°C

Dielectric Constant3.2 @ 1 kHz
Dissipation Factor0.008 @ 1 kHz
Dielectric Strength (volts/mil)580
Volume Resistivity (ohm‐cm)7.0E 13 @ 500 VDC

Thermal Properties

Based on cure of 4 hours @ 65°C

Glass Transition Temp (°C)45
Degradation Temp. (°C)275

Outgassing Properties

Based on cure of 4 hours @ 65°C

TML (%)0.75
CVCM (%)0.01
WVR (%)0.39

Acoustic Properties

Velocity (m/s)2,345
Impedance (MRayls)2.51
Loss (dB/cm‐MHz)‐4.83
Density (g/cc)1.07

Key Features

  • Adheres to Dissimilar Materials
  • Self Leveling
  • Hydrolytic Stability
  • High Temperature Resistant
  • Low Shrinkage
  • Non‐hazardous per D.O.T. Regulations

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev I
11/7/2023

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