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5108 Epoxy
Self-leveling, withstands high humidity environments
5108 is a black, electrically isolating epoxy adhesive specifically designed for potting and sealing electronic components. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. This material is also environmentally friendly and considered non‐hazardous per D.O.T. regulations. 5108 is available in one-part pre-mixed and frozen syringes and two-part room temperature stable kits.
Uncured
| Pot Life @ 25°C | 2 hours |
|---|---|
| Viscosity, Part A @25°C | 2,100 cPs |
| Viscosity, Part B @25°C | 11,000 cPs |
| Viscosity, mixed @ 25°C | 5,000 cPs |
| Shelf Life, PMF | @ ‐40°C 6 Months |
| Shelf Life, 2-Part Kit | @18°C to 25°C 12 Months |
| Mix Ratio | 100A to 51.75B parts by weight |
Cure Options
1 hour @ 92°C 4 hours @ 65°C 48 hours @ 25°C
Cured Properties
Based on cure of 4 hours @ 65°C
| Color | Black |
|---|---|
| Shore D Hardness | 80 |
| Lap Shear (psi) | 3500 |
| Density (g/cc) | 1.07 |
| Glass Transition Temp (°C) | 45 |
| Shrinkage Linear (%) | 0.26 |
Electrical Properties
Based on cure of 4 hours @ 65°C
| Dielectric Constant | 3.2 @ 1 kHz |
|---|---|
| Dissipation Factor | 0.008 @ 1 kHz |
| Dielectric Strength (volts/mil) | 580 |
| Volume Resistivity (ohm‐cm) | 7.0E 13 @ 500 VDC |
Thermal Properties
Based on cure of 4 hours @ 65°C
| Glass Transition Temp (°C) | 45 |
|---|---|
| Degradation Temp. (°C) | 275 |
Outgassing Properties
Based on cure of 4 hours @ 65°C
| TML (%) | 0.75 |
|---|---|
| CVCM (%) | 0.01 |
| WVR (%) | 0.39 |
Acoustic Properties
| Velocity (m/s) | 2,345 |
|---|---|
| Impedance (MRayls) | 2.51 |
| Loss (dB/cm‐MHz) | ‐4.83 |
| Density (g/cc) | 1.07 |
Key Features
- Adheres to Dissimilar Materials
- Ideal for Bonding, Potting & Encapsulation
- Self Leveling
- Hydrolytic Stability
- High Temperature Resistant
- Low Shrinkage
- Non‐hazardous per D.O.T. Regulations
- √ RoHS Compliant
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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