5108 Epoxy

Self-leveling, withstands high humidity environments

5108 is a one part, black, electrically isolating, precision mixed, degassed, and frozen epoxy compound specifically designed for potting and sealing electronic components. 5108 is a self leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. This material is also environmentally friendly and considered non‐hazardous per D.O.T. regulations.


Pot Life @ 25°C2 hours
Viscosity @ 25°C5,000 cPs
Shelf Life @ ‐40°C6 months

Cure Options

1 hour @ 92°C 4 hours @ 65°C 48 hours @ 25°C

Cured Properties

Based on cure of 4 hours @ 65°C

Shore D Hardness80
Density (g/cc)1.07
Glass Transition Temp (°C)45
Shrinkage Linear (%)0.26

Electrical Properties

Based on cure of 4 hours @ 65°C

Dielectric Constant3.2 @ 1 kHz
Dissipation Factor0.008 @ 1 kHz
Volume Resistivity (ohm‐cm)7.0E 13 @ 500 VDC

Thermal Properties

Based on cure of 4 hours @ 65°C

Glass Transition Temp (°C)45
Degradation Temp. (°C)275

Outgassing Properties

Based on cure of 4 hours @ 65°C

TML (%)0.75
CVCM (%)0.01
WVR (%)0.39

Acoustic Properties

Velocity (m/s)2,345
Impedance (MRayles)2.51
Loss (dB/cm‐MHz)‐4.83
Density (g/cc)1.07

Key Features

  • Adheres to Dissimilar Materials
  • Self Leveling
  • Hydrolytic Stability
  • High Temperature Resistant
  • Low Shrinkage
  • Non‐hazardous per D.O.T. Regulations

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev E

How to get started

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