0709 Polyurethane Adhesive

Ideal for advanced electronic assembly

0709 is a dark gray, thermally conductive, precision mixed, degassed, and frozen polyurethane adhesive compound for advanced electronic assembly. 0709 (Hacthane 121 B‐1) is HMS‐2353, Type IV certified. This thixotropic compound is suitable for electronic bonding, staking, and may be used as a fillet as well. 0709 has a thermal conductivity of 0.9 W/mK, ideal for heat dissipation of components. 0709 cures to a tough and flexible material with low modulus and a very low Glass Transition Temperature (Tg). The cured material’s ability to not crack or harm bonded rigid components during thermal cycling provides a major advantage, as it will not compromise the integrity of the component. The CTE of 0709 is lower than conventional polyurethane elastomers, while retaining relatively low modulus. 0709 provides thermal conductivity and strain relief for many staking applications.

Uncured

Pot Life @ 25°C1.5 hours
Viscosity @ 25°CPaste
Shelf Life @ ‐40°C3 months

Cure Options

1.5 hours @ 74°C 24 hours @ 25°C (Handling) 72 hours @ 25°C (Full Cure)

Cured Properties

Based on cure of 1.5 hours @ 74°C

ColorDark Gray
Shore A Hardness88
Glass Transition Temp (°C)‐65
Density (g/cc)2.3
Lap Shear 2024T3 Clad (psi)750
Elongation (%)40

Electrical Properties

Based on cure of 1.5 hours @ 74°C

Dielectric Constant4.6 @ 1 MHz
Volume Resistivity (ohm‐cm)1.0E 14 @ 500 VDC

Thermal Properties

Based on cure of 1.5 hours @ 74°C

CTE below Tg (ppm/°C)55
CTE above Tg (ppm/°C)140
Glass Transition Temp (°C)‐65
Operating Temp. Range (°C)‐100 to 125
Thermal Conductivity (W/mK)0.9

Acoustic Properties

Velocity (m/s)1,434
Impedance (MRayls)3.275
Loss (dB/cm‐MHz)‐12.4
Density (g/cc)2.28

Key Features

  • Hacthane 121 B‐1
  • HMS‐2353, Type IV
  • Thixotropic
  • Thermally Conductive
  • Electrically Insulative
  • Semi‐flexible
  • Long Pot Life
  • Low Glass Transition Temperature
  • Bonds Well to Most Substrates
  • Solvent Resistant
  • Hydrolytic Stability

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev H
11/06/2023

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