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5200 Epoxy
2.5 W/mK + electrically conductive
A silver-filled, electrically conductive, low outgassing epoxy, Appli-Tec’s 5200 is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures. The material is ideal for applications such as electrical bonding, EMI shielding, and room temperature soldering. 5200 exhibits a high thermal conductivity of 2.5 W/mK and a low volume resistivity of 0.002 ohm-cm, delivering excellent thermal and electrical conductivity across the bond line. Appli-Tec 5200 silver epoxy is available in bulk kits or two-part mixer pouches that can be stored at room temperature and mixed on site. We can also pre-mix, test, pre-pack and then flash freeze the material in manual or pneumatic dispense syringes, which are easily thawed at room temperature. The material is listed on NASA’s Low Outgassing website.
Uncured
| Pot Life @ 25°C | 30 minutes |
|---|---|
| Viscosity Part A @ 25°C | Paste |
| Viscosity Part B @ 25°C | 25 cPs |
| Shelf Life @ -40°C | 6 Months |
| Shelf Life @ -60°C | 10 Months |
| Shelf Life @ -75°C | 24 Months |
| Shelf Life @ 25°C | 6 Months (Appli-Pac®, Bulk Kit) |
| Mix Ratio | 100A:4.31B Parts By Weight |
Cure Options
2 hours @ 65°C 24 hours @ 25°C 30 minutes @ 100°C
Cured Properties
Based on cure of 2 hours @ 65°C
| Color | Silver |
|---|---|
| Shore D Hardness | 90 |
| Glass Transition Temp (°C) | 85 |
| Specific Gravity | 2.75 |
| Lap Shear 2024T3 Clad (psi) | 1,200 |
Electrical Properties
Based on cure of 2 hours @ 65°C
| Volume Resistivity (ohm-cm) | 2.0E-3 |
|---|
Thermal Properties
Based on cure of 2 hours @ 65°C
| Glass Transition Temp (°C) | 85 |
|---|---|
| Operating Temp. Range (°C) | -60 to 120 |
| Thermal Conductivity (W/mK) | 2.5 |
| Degradation Temp. (°C) | 300 |
Outgassing Properties
Based on cure of 2 hours @ 65°C
| TML (%) | 0.19 |
|---|---|
| CVCM (%) | 0.00 |
| WVR (%) | 0.17 |
Key Features
- High Electrical Conductivity
- Listed on NASA Low Outgassing Website
- Low Shrinkage
- Room Temperature Cure
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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