All Appli-Tec adhesives come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing.
Appli-Tec’s high-performance, thermally conductive urethanes and epoxies deliver the following:
The adhesive materials listed range from our highest thermally conductive to the lowest. Each one can be modified to suit your application:
Don’t see what you need? Check our Adhesive Materials & TDS page or call 603-685-0500.
Best-in-class thermal conductivity for aggressive heat dissipation. 5390 combines an independently verified 4.3 W/mK thermal conductivity with electrically insulative properties. Dark gray and self-leveling, this epoxy is ideal for heat sink attach applications and features a 5-hour pot life.
Ideal for aerospace applications as the cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. The material is self-leveling, injectable, and cures to a semi-flexible material with relatively low modulus and very low Tg.
Designed specifically for potting circuit boards connectors. 5302 is ideal for automated dispensing and features controlled flow – making it easy to deposit. The cured material can withstand high-temperature environments and is resistant to fuel, lubricants, water, and weather. 5302 has a wide range of curing options and bonds well with most substrates.
Designed specifically for staking and encapsulating electronics on circuit boards. A black, electrically isolating, thermally conductive epoxy, 5336 is also used for potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is a flowable epoxy with low shrinkage.
Eliminates need for a separate cure cycle. The perfect choice for automated dispensing, Appli-Thane® 7308 is a self-leveling injectable compound, that maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. The material is electrically insulative and cures to a semi-flexible material with low modulus and a very low Tg. It will not crack or harm bonded rigid components during thermal cycling.
Will not harm, bend or break highly fragile substrates during extreme thermal cycling. Because epoxies are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane with low modulus and very low Tg. A thixotropic, thermally conductive compound, Appli-Thane® 7340 is suitable for electro-optics bonding and staking and may be used as a fillet as well.