Thermally Conductive, Electrically Insulative

Adhesives, Epoxies & Urethanes engineered for high-heat electronic applications

Photo of Appli-Thane® 7300 adhesive being used for bonding a heat sink that required maximum thermal conductivity — one of many applications for this versatile material.

Appli-Tec’s high-performance, thermally conductive adhesives and epoxies serve two purposes:

  • Efficiently dissipate the very high heat generated by microelectronic components.
  • Deliver significantly higher shear strength — allowing for a more intimate and stronger contact between the two substrates being bonded.

All Appli-Tec adhesives come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing.

The adhesive materials listed range from our highest W/mK to the lowest. Each one can be modified to suit your application:

  • Adding spacer beads
  • Changing color
  • More or less thixotropy
  • Altering cure rates

Appli-Tec Thermally Conductive Epoxies and Urethanes

Appli-Thane® 7300 Urethane — 2.5 W/mK

Ideal for aerospace applications as it meets NASA’s outgassing requirements. The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components.

Key features: Self-leveling, injectable; cures to a semi-flexible material with relatively low modulus and very low Tg. Pre-mixed, degassed, tested and frozen polyurethane adhesive.

5200 Silver Epoxy — 2.5 W/mK

A silver-filled, electrically conductive, low outgassing epoxy, Appli-Tec’s 5200 is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures. The material is ideal for applications such as electrical bonding, EMI shielding, and room temperature soldering. 5200 exhibits a high thermal conductivity of 2.5W/mK and a low volume resistivity of 0.0008 ohm-cm, delivering excellent thermal and electrical conductivity across the bond line. The material is listed on NASA’s Low Outgassing website.

Key features: High electrical and thermal conductivity; low shrinkage; room temperature cure. Available as a pre-mixed, degassed, tested and frozen epoxy or room temp two-part mixer pouches.

5302 Epoxy — 1.85 W/mK

Designed specifically for potting circuit board connectors. With its 4-hour pot life, the material is ideal for automated dispensing and features controlled flow – making it easy to deposit. 5302 meets NASA’s outgassing requirements and has a wide range of curing options. The material bonds well with most substrates.

Key Features: Cured material can withstand high-temperature environments and is resistant to fuel, lubricants, water, and weather. A pre-mixed, degassed, tested and frozen epoxy.

5336 Epoxy — 1.48 W/mK

A black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

Key Features: Electrically isolating, high thermal conductivity, low shrinkage, and flowable.

5316 Epoxy — 1.38 W/mK

A flowable and electrically isolating epoxy designed specifically for underfilling, staking, and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. The material is ideal for applications requiring a room temperature cure, must be self-leveling, and have better than average thermal conductivity.

Key Features: The material cures at room temperature, is low viscosity, and has high thermal conductivity. A pre-mixed, degassed, tested and frozen epoxy.

5308 Epoxy — 1.26 W/mK

An electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. regulations.

Key features: High Tg, low shrinkage, flowable, 3 hour pot life. A pre-mixed, degassed, tested and frozen epoxy.

Appli-Thane® 7308 Urethane — W/mK 1.11

The perfect choice for automated dispensing. A self-leveling injectable compound, Appli-Thane® 7308 maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. It also eliminates the need for a separate cure cycle. The material meets NASA’s outgassing requirements and cures to a semi-flexible material with low modulus and a very low Tg.

Key features: Electrically insulative, semi-flexible, will not crack or harm bonded rigid components during thermocycling. A red  re-mixed, degassed, tested and frozen polyurethane adhesive paste.

Appli-Thane® 7340 Urethane — W/mK 1.00

Because epoxies are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme thermal cycling and vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane. It won’t harm, bend or break highly fragile substrates, such as glass and ceramic, when exposed to vibration and extreme thermal cycling. A thixotropic, thermally conductive compound, Appli-Thane® 7340 passes NASA’s outgassing requirements and is suitable for electronic bonding and staking and may be used as a fillet as well.

Key features: Thixotropic, electrically insulative; cures to a tough and flexible material with low modulus and very low Tg. A dark gray, pre-mixed, degassed, tested and frozen polyurethane adhesive.


How to get started

Whether you need a quote or you have questions about material availability, we can help.

Appli-Tec Customer Support

Super smart adhesive info for engineers by engineers.

Plus a little humor too. Delivered to your inbox once a month.