Thermally Conductive, Electrically Insulative

Adhesives & Epoxies engineered for high-heat electronic applications

Photo of Appli-Thane® 7300 adhesive being used for bonding a heat sink that required maximum thermal conductivity — one of many applications for this versatile material.

Electronics produce a lot of heat, and the smaller they are, the more heat they produce.

Appli-Tec’s high-performance, thermally conductive adhesives and epoxies serve two purposes:

  • Efficiently dissipate the very high heat generated by microelectronic components.
  • Deliver significantly higher shear strength — allowing for a more intimate and stronger contact between the two substrates being bonded.

Used in industries where performance is critical, including aerospace, defense, sensors, and devices, Appli-Tec’s  adhesives are ready to use for:

  • Manual and automatic dispensing
  • Staking & encapsulating electronics
  • Potting power supplies, transformers, coils
  • Advanced electronic assembly

All Appli-Tec adhesives come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing.

Thermally conductive adhesives vs. conductive pads: what's the difference? Read our FAQ to learn more.

Appli-Tec Thermally Conductive Adhesives

The materials listed can be modified to suit your application — e.g. adding spacer beads, changing color, more or less thixotropy, and altering cure rates.

Appli-Thane® 7300 Urethane — 2.5 W/mK

Designed for advanced electronic assembly. 7300 cures to a semi‐flexible material which can be reworked without damaging substrates. The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus.

Key features: Our highest thermal conductivity adhesive, electrically insulative, superior thermal cycling, hydrolytic stability. Pre-mixed, degassed, tested and frozen.

5302 Epoxy — 1.70 W/mK

Ideal for encapsulating and underfilling electronic components, 5302 withstands high-temperature environments and is resistant to fuel, lubricants, water, and weather.

Key Features: High thermal conductivity, bonds well to most substrates, high Tg (Glass Transition Temperature, 4 hour pot life. Pre-mixed, degassed, tested and frozen.

5308 Epoxy — 1.26 W/mK

Designed specifically for underfilling, staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. 5308 is resistant to solvents and chemicals.

Key features: D.O.T. non-hazardous, high Tg, low shrinkage, flowable, 3 hour pot life. Pre-mixed, degassed, tested and frozen.

Appli-Thane® 7308 Urethane — W/mK 1.11

A self-leveling, injectable compound suitable for electronic bonding and potting, 7308 may also be used for bonding leaded components. With its 8 hour pot life, the material is perfect for automated dispensing.

Key features: Mass-reflow curable, electrically insulative, semi-flexible, superior thermocycling, hydrolytic stability. Pre-mixed, degassed, tested and frozen.

Appli-Thane® 7340 Urethane — W/mK 1.00

Because epoxy systems are hard and high modulus after cure, they typically fail when exposed to extreme thermal cycling and vibration environments. Appli‐Thane 7340 will not harm, bend or break highly fragile substrates, such as glass and ceramic, when exposed to vibration and extreme thermal cycling.

Key features: Thixotropic, electrically insulative, semi‐flexible, superior thermal cycling, hydrolytic stability, long pot life. Pre-mixed, degassed, tested and frozen.

5315 Epoxy — 0.80 W/mK

A casting compound for encapsulating power supplies, transformers, and coils. 5315 has excellent electrical insulating properties and is resistant to solvents and chemicals.

Key features: D.O.T. non-hazardous, high Tg, low shrinkage, 4 hour pot life. Pre-mixed, degassed, tested and frozen.


How to get started

Whether you need a quote or you have questions about material availability, we can help.

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