Appli-Thane® 7340

A low modulus, high strength material - Ideal for staking components

Because they are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme thermal cycling and vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane. It won’t harm, bend or break highly fragile substrates, such as glass and ceramic, when exposed to vibration and extreme thermal cycling. A thixotropic, thermally conductive compound, Appli-Thane® 7340 passes NASA’s outgassing requirements and is suitable for electro-optics bonding and staking and may be used as a fillet as well.


Work Life @ 25°C1.5 hours
Viscosity @ 25°CPaste
Shelf Life @ -40°C6 Months

Cure Options

1.5 hours @ 74°C + 72 hours @ 25°C 7 days @ 25°C

ColorDark Gray
Shore A Hardness92
Shore D Hardness45
Glass Transition Temp (°C)-70
Density (g/cc)2.3
Lap Shear 2024T3 Clad (psi)1,300
Tensile Strength (psi)900
Tensile Modulus (psi)7,500
Elongation (%)20
Storage Modulus (psi)4,000
Linear Shrinkage (%)0.04 cured 192 hours @ 22°C 0.14 cured 8 hours @ 71°C

Electrical Properties

1.5 hours @ 74°C + 72 hours @ 25°C

Dielectric Constant5.3 @ 10 kHz 5.1 @ 100 kHz 4.9 @ 1 MHz
Dissipation Factor0.032 @ 10 kHz 0.028 @ 100 kHz 0.023 @ 1 MHz
Dielectric Strength (volts/mil)480
Volume Resistivity (ohm-cm)1.0E 15 @ 500 VDC

Thermal Properties

1.5 hours @ 74°C + 72 hours @ 25°C

CTE below Tg (ppm/°C)50
CTE above Tg (ppm/°C)121
Glass Transition Temp (°C)-70
Operating Temp. Range (°C)-100 to 125
Thermal Conductivity (W/mK)1.0

Outgassing Properties

Based on cure of 1.5 hours @ 74°C

TML (%)0.13
CVCM (%)0.01
WVR (%)0.05

Acoustic Properties

Velocity (m/s)1,437
Impedance (MRayls)3.36
Loss (dB/cm-MHz)-13.2
Density (g/cc)2.3

Key Features

  • Thixotropic
  • Thermally Conductive
  • Electrically Insulative
  • Semi-flexible
  • Superior Thermal Cycling
  • Hydrolytic Stability
  • Long Pot Life
  • Low Glass Transition Temperature
  • Low Modulus
  • Meets NASA Outgassing Requirements
  • Solvent Resistant
  • Low Shrinkage During Cure

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev I

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