Search this site
Appli-Thane® 7340
A low modulus, high strength material - Ideal for staking components
Because they are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme thermal cycling and vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane. It won’t harm, bend or break highly fragile substrates, such as glass and ceramic, when exposed to vibration and extreme thermal cycling. A thixotropic, thermally conductive compound, Appli-Thane® 7340 passes NASA’s outgassing requirements and is suitable for electro-optics bonding and staking and may be used as a fillet as well.
Uncured
| Work Life @ 25°C | 1.5 hours |
|---|---|
| Viscosity @ 25°C | Paste |
| Shelf Life @ -40°C | 6 Months |
Cure Options
1.5 hours @ 74°C + 72 hours @ 25°C 7 days @ 25°C
| Color | Dark Gray |
|---|---|
| Shore A Hardness | 92 |
| Shore D Hardness | 45 |
| Glass Transition Temp (°C) | -70 |
| Density (g/cc) | 2.3 |
| Lap Shear 2024T3 Clad (psi) | 1,300 |
| Tensile Strength (psi) | 900 |
| Tensile Modulus (psi) | 7,500 |
| Elongation (%) | 20 |
| Storage Modulus (psi) | 4,000 |
| Linear Shrinkage (%) | 0.04 cured 192 hours @ 22°C 0.14 cured 8 hours @ 71°C |
Electrical Properties
1.5 hours @ 74°C + 72 hours @ 25°C
| Dielectric Constant | 5.3 @ 10 kHz 5.1 @ 100 kHz 4.9 @ 1 MHz |
|---|---|
| Dissipation Factor | 0.032 @ 10 kHz 0.028 @ 100 kHz 0.023 @ 1 MHz |
| Dielectric Strength (volts/mil) | 480 |
| Volume Resistivity (ohm-cm) | 1.0E 15 @ 500 VDC |
Thermal Properties
1.5 hours @ 74°C + 72 hours @ 25°C
| CTE below Tg (ppm/°C) | 50 |
|---|---|
| CTE above Tg (ppm/°C) | 121 |
| Glass Transition Temp (°C) | -70 |
| Operating Temp. Range (°C) | -100 to 125 |
| Thermal Conductivity (W/mK) | 1.0 |
Outgassing Properties
Based on cure of 1.5 hours @ 74°C
| TML (%) | 0.13 |
|---|---|
| CVCM (%) | 0.01 |
| WVR (%) | 0.05 |
Acoustic Properties
| Velocity (m/s) | 1,437 |
|---|---|
| Impedance (MRayls) | 3.36 |
| Loss (dB/cm-MHz) | -13.2 |
| Density (g/cc) | 2.3 |
Key Features
- Thixotropic
- Thermally Conductive
- Electrically Insulative
- Semi-flexible
- Superior Thermal Cycling
- Hydrolytic Stability
- Long Pot Life
- Low Glass Transition Temperature
- Low Modulus
- Meets NASA Outgassing Requirements
- Solvent Resistant
- Low Shrinkage During Cure
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
New Applications
I want to discuss my application challenges, order samples, or place a first-time order.
Existing Applications
I need to reorder an existing part number, I have a BOM/Spec.