Low Outgassing Aerospace Adhesives

Best-in-class thermal conductivity for aggressive heat dissipation. 5390 combines an independently verified 4.3 W/mK thermal conductivity with electrically insulative properties. Dark gray and self-leveling, this epoxy is ideal for heat sink attach applications and features a 5-hour pot life.

Key features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Bonding
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Ideal for electronics applications requiring high heat dissipation. 5380 combines high thermal conductivity with electrically insulative properties. Dark gray and self-leveling, the material features a 6-hour pot life and meets NASA’s outgassing requirements.

Key features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Potting, Bonding
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Ideal for aerospace applications as the cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. The material is self-leveling, injectable, and cures to a semi-flexible material with relatively low modulus and very low Tg.

Key features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Bonding, Potting
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Ideal for applications such as electrical bonding, EMI shielding, and room temperature soldering. A silver-filled, electrically conductive, low outgassing epoxy, Appli-Tec’s 5200 Epoxy is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures.

Key features:

• Electrically Insulative: No
• Low Outgas E595: Yes – Listed on NASA’s Low Outgassing website
• Applications: Bonding, Staking
• Two-part Kit: Yes

Eliminates need for a separate cure cycle. The perfect choice for automated dispensing, Appli-Thane® 7308 is an injectable compound, that maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. The material is electrically insulative and cures to a semi-flexible material with low modulus and a very low Tg. It will not crack or harm bonded rigid components during thermal cycling.

Key Features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Bonding, Potting, Staking, Encapsulation
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Will not harm, bend or break highly fragile substrates during extreme thermal cycling. Because epoxies are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane with low modulus and very low Tg. A thixotropic, thermally conductive compound, Appli-Thane® 7340 is suitable for electro-optics bonding and staking and may be used as a fillet as well.

Key Features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Bonding, Staking
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Ideal for operating at elevated temperatures. 5010 Epoxy bonds well to most substrates such as glass, plastics, and ceramics, and changes color upon cure to a dark red. This material is specifically designed to have a long pot life and a high glass transition temperature — making 5010 ideal for operating at elevated temperatures. 5010 is resistant to fuel, lubricants, water, and weather.

Key Features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes – Listed on NASA’s Low Outgassing website
• Applications: Bonding
• Two-part Kit: Yes

Ideal for bonding and staking applications. This thixotropic, easily reworkable aerospace urethane features a room temperature cure while also meeting NASA’s low outgassing requirements. With low modulus and low Tg, Appli-Thane 7800 is a suitable substitute for many silicones in electronic applications. The material features long pot life, short cure time, and a long shelf life. Choose from translucent or a blue color if visual inspection is needed.

Key Features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Bonding, Staking
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

A free-flowing version of our 7800 material; ideal for coating applications. Both Appli-Thane 7810 and 7800 are often used together for “dam and fill”: use the higher viscosity 7800 to create the dam, then 7810 to fill in. Appli-Thane 7810 features good flow and wetting, is easily reworkable, and meets NASA’s low outgassing requirements.

Key Features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Potting, Staking, Encapsulation
• Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Ideal for potting and encapsulation of advanced electronic assemblies. With a Shore A hardness of 70, Appli-Thane 7125 is a soft urethane material that provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. Our lowest viscosity urethane product, the material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. The self-leveling material is non-hazardous, transparent, and flexible; potted components de-air easily.

Key Features:

• Electrically Insulative: Yes
• Low Outgas E595: Yes
• Applications: Potting, Encapsulation
• Two-part Kit: Yes, and Pre-Mixed Frozen (PMF)