Low Outgassing Aerospace Adhesives

Urethanes and epoxies for high-performance electronics bonding, staking & potting applications
James Webb space telescope in deep space research far galaxies.

NASA’s James Webb space telescope in deep space research far galaxies. (Elements of this image furnished by NASA.)

Delivering proven performance for mission-critical aerospace applications and high-performance electronics assemblies, Appli-Tec’s Aerospace Adhesives listed on this page are tested to meet ASTM-E595 low outgassing specifications.

Developed with process/manufacturing engineers in mind, the majority of these materials have greater than one-hour pot life. Many will cure at room temperature. They also pass the necessary requirements for crewed and uncrewed space flight.

All of these adhesives come precision mixed, degassed and frozen. They’re pre-tested and packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing.

Don’t see what you need? Check our Adhesive Materials & TDS page or call 603-685-0500.


Proven performance for mission-critical aerospace applications

5390 Epoxy — 4.3 W/mK

Best-in-class thermal conductivity for aggressive heat dissipation. 5390 combines an independently verified 4.3 W/mK thermal conductivity with electrically insulative properties. Dark gray and self-leveling, this epoxy is ideal for heat sink attach applications and features a 5-hour pot life.

Key features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Bonding
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

5380 Epoxy — 3.2 W/mK

Ideal for electronics applications requiring high heat dissipation. 5380 combines high thermal conductivity with electrically insulative properties. Dark gray and self-leveling, the material features a 6-hour pot life and meets NASA’s outgassing requirements.

Key features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Potting, Bonding
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Appli-Thane® 7300 Urethane — 2.5 W/mK

Ideal for aerospace applications as the cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. The material is self-leveling, injectable, and cures to a semi-flexible material with relatively low modulus and very low Tg.

Key features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Bonding, Potting
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

5200 Epoxy — 2.5 W/mK

Ideal for applications such as electrical bonding, EMI shielding, and room temperature soldering. A silver-filled, electrically conductive, low outgassing epoxy, Appli-Tec’s 5200 Epoxy is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures.

Key features:

  • Electrically Insulative: No
  • Low Outgas E595: Yes – Listed on NASA’s Low Outgassing website
  • Applications: Bonding, Staking
  • Two-part Kit: Yes

Appli-Thane® 7308 Urethane — 1.11 W/mK

Eliminates need for a separate cure cycle. The perfect choice for automated dispensing, Appli-Thane® 7308 is an injectable compound, that maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. The material is electrically insulative and cures to a semi-flexible material with low modulus and a very low Tg. It will not crack or harm bonded rigid components during thermal cycling.

Key Features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Bonding, Potting, Staking, Encapsulation
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Appli-Thane® 7340 Urethane — 1.00 W/mK

Will not harm, bend or break highly fragile substrates during extreme thermal cycling. Because epoxies are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane with low modulus and very low Tg. A thixotropic, thermally conductive compound, Appli-Thane® 7340 is suitable for electro-optics bonding and staking and may be used as a fillet as well.

Key Features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Bonding, Staking
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

5010 Epoxy — <0.3 W/mK

Ideal for operating at elevated temperatures. 5010 Epoxy bonds well to most substrates such as glass, plastics, and ceramics, and changes color upon cure to a dark red. This material is specifically designed to have a long pot life and a high glass transition temperature — making 5010 ideal for operating at elevated temperatures. 5010 is resistant to fuel, lubricants, water, and weather.

Key Features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes – Listed on NASA’s Low Outgassing website
  • Applications: Bonding
  • Two-part Kit: Yes

Appli-Thane® 7800

Ideal for bonding and staking applications. This thixotropic, easily reworkable aerospace urethane features a room temperature cure while also meeting NASA’s low outgassing requirements. With low modulus and low Tg, Appli-Thane 7800 is a suitable substitute for many silicones in electronic applications. The material features long pot life, short cure time, and a long shelf life. Choose from translucent or a blue color if visual inspection is needed.

Key Features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Bonding, Staking
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Appli-Thane® 7810

A free-flowing version of our 7800 material; ideal for coating applications. Both Appli-Thane 7810 and 7800 are often used together for “dam and fill”: use the higher viscosity 7800 to create the dam, then 7810 to fill in. Appli-Thane 7810 features good flow and wetting, is easily reworkable, and meets NASA’s low outgassing requirements.

Key Features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Potting, Staking, Encapsulation
  • Two-part Kit: No, Pre-Mixed Frozen (PMF) only

Appli-Thane® 7125 Urethane

Ideal for potting and encapsulation of advanced electronic assemblies. With a Shore A hardness of 70, Appli-Thane 7125 is a soft urethane material that provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. Our lowest viscosity urethane product, the material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. The self-leveling material is non-hazardous, transparent, and flexible; potted components de-air easily.

Key Features:

  • Electrically Insulative: Yes
  • Low Outgas E595: Yes
  • Applications: Potting, Encapsulation
  • Two-part Kit: Yes, and Pre-Mixed Frozen (PMF)

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