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Delivering proven performance for mission-critical aerospace applications and high-performance electronics assemblies, all Appli-Thane adhesives listed are ASTM-E595 low outgassing and low modulus.
Developed with process/manufacturing engineers in mind, Appli-Thane® materials have greater than one-hour pot life. Many will cure at room temperature.
Due to their longer pot life and shorter cure times, Appli-Thane pre-mixed and frozen adhesives are ideal for high-performance electronics staking and potting applications.
All Appli-Tec adhesives come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing.
Don’t see what you need? Check our Adhesive Materials & TDS page or call 603-685-0500.
Best-in-class thermal conductivity for aggressive heat dissipation. Ideal for aerospace applications as the cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. The material is self-leveling, injectable, and cures to a semi-flexible material with relatively low modulus and very low Tg.
Will not harm, bend or break highly fragile substrates during extreme thermal cycling. Because epoxies are hard and high modulus after cure, many aerospace epoxy systems will fail when exposed to extreme vibration environments. Designed as replacement material for these systems, Appli-Thane® 7340 is an easy-to-use polyurethane with low modulus and very low Tg. A thixotropic, thermally conductive compound, Appli-Thane® 7340 is suitable for electro-optics bonding and staking and may be used as a fillet as well.
Eliminates need for a separate cure cycle. The perfect choice for automated dispensing, Appli-Thane® 7308 is a self-leveling injectable compound, that maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. The material is electrically insulative and cures to a semi-flexible material with low modulus and a very low Tg. It will not crack or harm bonded rigid components during thermal cycling.
Ideal for bonding and staking applications. This thixotropic, easily reworkable aerospace urethane features a room temperature cure while also meeting NASA’s low outgassing requirements. With low modulus and low Tg, Appli-Thane 7800 is a suitable substitute for many silicones in electronic applications. The material features long pot life, short cure time, and a long shelf life. Choose from translucent or a blue color if visual inspection is needed.
A free-flowing version of our 7800 material; ideal for coating applications. Both Appli-Thane 7810 and 7800 are often used together for “dam and fill”: use the higher viscosity 7800 to create the dam, then 7810 to fill in. Appli-Thane 7810 features good flow and wetting, is easily reworkable, and meets NASA’s low outgassing requirements.
Ideal for potting and encapsulation of advanced electronic assemblies. With a Shore A hardness of 70, Appli-Thane 7125 is a soft urethane material that provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. Our lowest viscosity urethane product, the material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. The self-leveling material is non-hazardous, transparent, and flexible; potted components de-air easily.
Whether you need a quote or you have questions about material availability, we can help.