0176 Epoxy

Low shrinkage during cure

0176 is a one‐component, gray, high strength, electrically insulative, precision mixed, degassed, and frozen epoxy. It features low shrinkage during cure, bonds well to most substrates, and works as gap filler or staking material. 0176 is can be cured at room or elevated temperatures and is available in either an Appli‐Pac® or precision mixed, degassed, and frozen syringes. The material meets NASA outgassing at multiple cure temperatures.


Viscosity @ 25°C55,000 cPs
Pot Life @ 25°C1.25 hours
Shelf Life12 months @ 25°C (Appli‐Pac®) 6 months @ ‐40°C (Cryo‐Pac®) 10 months @ ‐60°C (Cryo‐Pac®)

Cure Options

24 hours @ 25°C 8 hours @ 45°C 2 hours @ 71°C

Cured Properties

Based on cure of 2 hours @ 71°C

Shore D Hardness70
Glass Transition Temp (°C)23
Lap Shear 2024T3 Clad (psi)3,500
% Shrinkage Linear0.9

Electrical Properties

Based on cure of 2 hours @ 71°C

Dielectric Constant3.4 @ 1000 Hz
Dissipation Factor0.05 @ 1000 Hz
Volume Resistivity (ohm‐cm)1.0E 15 @ 500 VDC

Outgassing Properties

Based on cure of 24 hours @ 25°C

TML (%)0.77
CVCM (%)0.01
WVR (%)0.22

Outgassing Properties

Based on cure of 8 hours @ 45°C

TML (%)0.75
CVCM (%)0.01
WVR (%)0.22

Outgassing Properties

Based on cure of 2 hours @ 71°C

TML (%)0.63
CVCM (%)0.02
WVR (%)0.25

Acoustic Properties

Velocity (m/s)2,420
Impedance (MRayls)3.254
Loss (dB/cm‐MHz)‐7.3
Density (g/cc)1.35

Key Features

  • Bonds Well to Most Substrates
  • Electrically Isolating
  • Meets NASA Outgassing at Multiple Cure Temps.
  • Low Shrinkage
  • Room or Elevated Temperature Cure
  • User‐friendly Packaging

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev F

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