Our rigorously tested adhesive products solve the challenges associated with advanced potting and encapsulation applications including:
All Appli-Tec potting compounds come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing.
The materials listed below are available as pre-mixed and frozen (PMF) with two-part kits available in some instances.
For a comparison discussion of material chemistries, see our FAQ, The Pros and Cons of Epoxies, Urethanes, and Silicone Adhesives.
By nature, epoxy and polyurethanes are electrically insulative; the degree varies based on the specific formulation. Volume resistivity for the materials listed is greater than 1×1014.
Each adhesive listed can be modified to suit your application:
Don’t see what you need? Check our Adhesive Materials & TDS page or call 603-685-0500.
Best-in-class thermal conductivity for aggressive heat dissipation. Ideal for aerospace applications as the cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. The material is self-leveling, injectable, and cures to a semi-flexible material with relatively low modulus and very low Tg.
Designed specifically for staking and encapsulating electronics on circuit boards. A black, electrically isolating, thermally conductive epoxy, 5336 is also used for potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is a flowable epoxy with low shrinkage.
Ideal for potting and encapsulation of advanced electronic assemblies. With a Shore A hardness of 70, Appli-Thane 7125 is a soft urethane material that provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. Our lowest viscosity urethane product, the material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. The self-leveling material is non-hazardous, transparent, and flexible; potted components de-air easily.
A free-flowing material ideal for potting and underfill applications. An optically clear, low viscosity, electrically isolating epoxy compound, 5051 bonds well to most substrates such as metals, glass, ceramics, and most plastics. 5051 wicks easily into tight spaces and features an 8-hour work life.
Specifically designed for potting and sealing electronic components. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. A black, electrically isolating epoxy compound, the material adheres to dissimilar materials. It’s also environmentally friendly and considered non‐hazardous per D.O.T. regulations.
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