5302 Epoxy

1.85 W/mK

Appli-Tec 5302 epoxy was designed specifically for potting circuit board connectors. With its 4-hour pot life, the material is ideal for automated dispensing and features controlled flow – making it easy to deposit. 5302 meets NASA’s outgassing requirements and has a wide range of curing options. The material bonds well with most substrates.

This product will exotherm if cured at high temperatures in masses greater than 5 grams. Contact Appli-Tec for step cure instructions if curing in larger masses.


Pot Life @ 25°C4 hours
Viscosity @ 25°C125,000 cPs
Shelf Life @ -40°C12 Months
Thixotropic Index1.9

Cure options

1 hour @ 120°C 5 minutes @ 150°C

Cured Properties

Based on cure of 1 hour @ 120°C

ColorDark Tan
Shore D Hardness97
Glass Transition Temp. (°C)134
Density (g/cc)2.62
Lap Shear 2024T3 Clad (psi)2,500

Electrical Properties

Volume Resistivity (ohm-cm)2.13E 16 @500 VDC

Thermal Properties

Based on cure of 1 hour @ 120°C

Glass Transition Temp. (°C)134
Thermal Conductivity (W/mK)1.85
Degradation Temp. (°C)275

Outgassing Properties

Based on cure of 1 hour @ 120°C

TML (%)0.07
CVCM (%)<0.01
WVR (%)0.04

Acoustic Properties

Velocity (m/s)3,450
Impedance (MRayls)9.03
Loss (dB/cm-MHz)-8.3
Density (g/cc)2.62

Key Features

  • High Thermal Conductivity
  • Resistant to Fuel, Lubricants, Water, and Weather
  • Bonds Well to Most Substrates
  • Changes Color When Cured
  • Snap Cure at 150 °C
  • High Glass Transition Temperature
  • High Temperature Resistant
  • Long Pot Life
  • Meets NASA Outgassing Requirements
  • User-friendly Packaging

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev G

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