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0161 Epoxy
For structural bonding & staking applications where precise dispensing is required
0161 is a one‐component, slightly thixotropic, electrically isolating, precision mixed, degassed, and frozen epoxy. It exhibits low shrinkage once cured and is ideal for gap filling purposes. This product is designed for structural bonding and staking applications where precise dispensing is required. 0161 conforms to HMS‐2240 Type IX specifications and can be cured at room temperature.
Uncured
| Viscosity @ 25°C | 55,000 cPs |
|---|---|
| Thixotropic Index | 1.0 |
| Pot Life @ 25°C | 1 hour |
| Shelf Life @ ‐40°C | 6 months |
Cure Options
1 hour @ 93°C 7 days @ 25°C
Cured Properties
Based on cure of 1 hour @ 93°C
| Color | Green |
|---|---|
| Shore D Hardness | 88 |
| Glass Transition Temp (°C) | 87 |
| Lap Shear 2024T3 Clad (psi) | 3,500 |
Electrical Properties
Based on cure of 1 hour @ 93°C
| Dielectric Constant | 3.4 @ 1000 Hz |
|---|---|
| Dissipation Factor | 0.05 @ 1000 Hz |
| Volume Resistivity (ohm‐cm) | 1.0E 15 @ 500 VDC |
Thermal Properties
Based on cure of 1 hour @ 93°C
| Glass Transition Temp (°C) | 87 |
|---|
Outgassing Properties
Based on cure of 1 hour @ 93°C
| TML (%) | 0.27 |
|---|---|
| CVCM (%) | 0.01 |
| WVR (%) | 0.32 |
Key Features
- Bonds Well to Most Substrates
- Electrically Isolating
- Gap Filling
- Meets NASA Outgassing
- HMS 2240, Type IX
- Low Shrinkage
- Room or Elevated Temperature Cure
- User‐friendly Packaging
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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