0161 Epoxy

For structural bonding & staking applications where precise dispensing is required

0161 is a one‐component, slightly thixotropic, electrically isolating, precision mixed, degassed, and frozen epoxy. It exhibits low shrinkage once cured and is ideal for gap filling purposes. This product is designed for structural bonding and staking applications where precise dispensing is required. 0161 conforms to HMS‐2240 Type IX specifications and can be cured at room temperature.


Viscosity @ 25°C55,000 cPs
Thixotropic Index1.0
Pot Life @ 25°C1 hour
Shelf Life @ ‐40°C6 months

Cure Options

1 hour @ 93°C 7 days @ 25°C

Cured Properties

Based on cure of 1 hour @ 93°C

Shore D Hardness88
Glass Transition Temp (°C)87
Lap Shear 2024T3 Clad (psi)3,500

Electrical Properties

Based on cure of 1 hour @ 93°C

Dielectric Constant3.4 @ 1000 Hz
Dissipation Factor0.05 @ 1000 Hz
Volume Resistivity (ohm‐cm)1.0E 15 @ 500 VDC

Thermal Properties

Based on cure of 1 hour @ 93°C

Glass Transition Temp (°C)87

Outgassing Properties

Based on cure of 1 hour @ 93°C

TML (%)0.27
CVCM (%)0.01
WVR (%)0.32

Key Features

  • Bonds Well to Most Substrates
  • Electrically Isolating
  • Gap Filling
  • Meets NASA Outgassing
  • HMS 2240, Type IX
  • Low Shrinkage
  • Room or Elevated Temperature Cure
  • User‐friendly Packaging

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev 1/31/2022

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