More Info

vacuum-degassing How Vacuum Degassing Can Contaminate Your Adhesive Mix
November 18, 2016

How vacuum degassing can introduce contaminants into your mix – often unknowingly.

adhesive-voids Why You Have Voids in Your Cured Adhesive
September 22, 2016

Mixing multi-part adhesives requires a great deal of stirring, a process that whips in a lot of air.

thermometer Why Temperature and Humidity Affect Your Mix
September 15, 2016

Temperature and humidity greatly affect viscosity, pot life, adhesive performance, and cured properties.

wooden-sticks Adhesive Mix Variables that Lead to Failure
September 15, 2016

Three of the more common variables of the mix process that can lead to potential failure.

ASI Adhesives & Sealants Appli-Tec Featured in Adhesives and Sealants
August 1, 2016

A manufacturer outsourced its adhesive mixing and as a result, reduced contamination and risk while improving productivity.

appli-tec-urethane-adhesive Urethanes Absorb Stress of Thermocycling
May 13, 2016

Learn how urethane adhesives help mitigate the stresses of aerospace applications.

pmf-adhesive-syringes-appli-tec FAQ: Adhesive Pot Life and Syringe Size
May 13, 2016

What size syringe should you use for your adhesive application? Answer: “It depends.”

MH&L Appli-Tec Featured in MH&L for Meeting GHS Deadline
April 5, 2016

How Appli-Tec met OSHA’s Hazard Communication Standard for its adhesive products a month before the June 2015 deadline.

SDS Adhesive SDS Now Available on Appli-Tec’s Website
March 7, 2016

Print-ready SDS for Appli-Tec adhesive products now available for download.

thermally-conductive-adheives Appli-Thane 7300 Solves Circuit Board Heat Challenge
February 11, 2016

An engineer turned to Appli-Tec for an adhesive compound with high thermal conductivity and a 4-hour pot life.

HazCom GHS Appli-Tec Meets OSHA’s GHS Labeling Requirements
January 15, 2016

Becoming GHS compliant took over a year and included having to create labels that met the standard yet also fit size 3cc and 5cc syringes.

Manufacturer Reduces Board Failure Rate to 0.2%
November 5, 2015

After repeated attempts to solve exposed circuit board failure rate of 20%, a manufacturer turned to Appli-Tec for help.

Super smart adhesive info for engineers by engineers.

Plus a little humor too. Delivered to your inbox once a month.