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Articles by Alisha Adams
FAQ: “I Have a Difficult Adhesive Mix Ratio. Can Appli-Tec Help?”
The impact of mix ratio on adhesive performance is critical and impacts everything from cure rate to outgassing properties.
How Temperature and Humidity Affect Your Adhesive Mix
Temperature and humidity greatly affect viscosity, pot life, adhesive performance, and cured properties.
Room Temperature Cure vs. Oven Cure for Adhesives
The type of adhesive cure to use depends on your application, what you’re trying to achieve, and your time frame.
FAQ: “Are Appli-Tec Adhesives Solvent-Free?”
95% of our product line is solvent-free – meaning the materials aren’t flammable or have very low VOC emission.
Tech Tip: Bonding Small Electronics to Printed Circuit Boards
Learn why bonding components to PCBs is different than metal-to-metal bonding (e.g. aluminum to aluminum).
Three Benefits of Thermally Conductive Adhesives for High Reliability Heat Sink Applications
Appli-Tec thermally conductive adhesives eliminate the three challenges associated with thermal grease and pads for heat sink applications.
Bonding – Staking – Potting – Encapsulation: Choosing the Right Adhesive for Your Application
The key difference between potting and encapsulation explained.
Choosing Thermally Conductive Adhesives for Heat Sink Applications
Solve challenges with heat sink applications that thermal conductive pads can’t handle.
What’s Appli-Tec’s procedure for testing lap shear?
Testing an adhesive’s lap shear is important because it allows for a strength comparison between different adhesive materials on a known substrate.
Shelf Life Considerations FAQ
My Adhesive Material Seems Thicker Than Normal. What’s the Problem?
What are the advantages and disadvantages of Epoxy, Polyurethane, and Silicone Adhesives?
The choice of which chemistry to use is based on the application requirements.
Polyurethane Adhesives Absorb Stress for Aerospace Applications
Learn how urethane adhesives help mitigate the stresses of aerospace applications.