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5327 Epoxy
2.6 W/mK — Thermally conductive two-part epoxy
Designed for potting and bonding applications, 5327 Epoxy combines high thermal conductivity with electrically insulative properties. Dark gray and self-leveling, 5327 is ideal for electronics applications that require high heat dissipation. 5327 is offered in room temperature stable two-part packaging — as well as in PMF syringes.
Uncured
| Work Life | 6 hours @ 25°C |
|---|---|
| Viscosity, Part A, @ 25°C | 93,600 cPs |
| Viscosity, Part B, @ 25°C | 7,500 cPs |
| Viscosity, Mixed, @ 25°C | 46,400 cPs |
| Color, Part A | Dark Gray |
| Color, Part B | White |
| Shelf Life, PMF | 6 months @ -40°C |
| Shelf Life, Two-Part Kit | 12 months @ 25°C |
| Mix Ratio A:B | 100:41.6 Parts By Weight |
Cure Options
2 hours @ 80°C 1 hour @ 120°C
Cured Properties
Based on cure of 2 hours @ 80°C
| Color | Dark Gray |
|---|---|
| Shore D Hardness | D/90/0 |
| Glass Transition Temp (°C) | 36 |
| Density (g/cc) | 2.93 |
| Lap Shear 2024TS Clad (psi) | 2,170 |
| Linear Shrinkage (%) | 0.33 |
| Tensile Strength (psi) | 6,650 |
| Tensile Modulus (psi) | 4,420,000 |
| Comprehensive Strength (psi) | 18,500 |
| Comprehensive Modulus (psi) | 4,880,000 |
| Poisson’s Ratio | 0.33 |
| Extractable Ionics, ppm | Chloride: <0.005 Sodium: <0.005 Potassium: <0.02 |
Electrical Properties
Based on cure of 2 hours @ 80°C
| Dielectric Constant | 5.19 @ 1 MHz |
|---|---|
| Dissipation Factor | 0.014 @ 1 MHz |
| Dielectric Strength (volts/mil) | 424 |
| Volume Resistivity (ohm-cm) | 6.3E+14 @ 500 VDC |
Thermal Properties
Based on cure of 2 hours @ 80°C
| CTE below Tg (ppm/°C) | 19.2 |
|---|---|
| CTE above Tg (ppm/°C) | 56.8 |
| Glass Transition Temp (°C) | 36 |
| Operating Temp. Range (°C) | -100 to 160 |
| Thermal Conductivity (W/mK) | 2.6 |
Outgassing Properties
Based on cure of 2 hours @ 80°C
| TML (%) | 0.45 |
|---|---|
| CVCM (%) | 0.09 |
| WVR (%) | 0.03 |
Acoustic Properties
| Velocity (m/s) | 4,062 |
|---|---|
| Impedance (MRayls) | 11.89 |
| Loss (dB/cm-MHz) | -9.03 |
| Density (g/cc) | 2.93 |
Key Features
- High Thermal Conductivity
- Electrically Insulative
- Meets NASA Outgassing Requirements
- Potting and Bonding Applications
- Two-Part Room Temperature Stable Package
- Long Pot Life
- Self-Leveling
- Solvent Reistant
- √ RoHS Compliant
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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