Case Study: Appli-Thane 7300 Solves Circuit Board Heat Challenge

by on February 11, 2016

Photo of Appli-Thane® 7300 adhesive being used for bonding a heat sink that required maximum thermal conductivity — one of many applications for this versatile material.


A company needed to redesign a circuit board in order to reduce the size and weight of the electronic components. The redesign, however, would result in higher heat generation. The old design incorporated a heat sink but with the smaller footprint and lower overall weight of the new board, a second heat sink wasn’t an option.


Most thermally conductive adhesives have a thermal conductivity of 1.25 W/mK, which was too low for the redesigned board and the high heat it would generate. The project engineer began sourcing a new adhesive and turned to Appli-Tec’s Appli-Thane® 7300.

A urethane-based, low outgassing (ASTM E595) adhesive, Appli-Thane 7300 met the engineer’s requirement for a 2.5 W/mK thermally conductive urethane. The adhesive met other requirements as well, including a >4 hour pot life due to being dispensed robotically.

Other required properties that Appli-Thane 7300 met included:

  • Self-leveling consistency
  • Hydrolytic stability
  • Superior thermal cycling
  • Low tensile modulus
  • Electrically insulative


Testing proved the adhesive solved the engineer’s application challenges. By incorporating Appli-Thane 7300, the engineer was able to meet the new design criteria for the board as well as ensure the new adhesive was suitable for automatic dispensing.

The CEO of Appli-Tec, Tim has over 30 years of experience in the pre-mixed and frozen (PMF) adhesives industry.

See more articles by Tim »

General Inquiry

I have a technical question, need an SDS, etc.

Email Customer Service

New Applications

I want to discuss my application challenges, order samples, or place a first-time order.

Email a Technical Specialist

Existing Applications

I need to reorder an existing part number, I have a BOM/Spec.

Email Inside Sales