5308 Epoxy
1.26 W/mK
An electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. regulations.
Uncured
| Pot Life @ 25°C | 3 hours |
|---|---|
| Viscosity @ 25°C | 100,000 cPs |
| Shelf Life @ -40°C | 12 Months (Cryo-Pac®) |
| Shelf Life @ 25°C | 12 Months (Appli-Pac®) |
| Mix Ratio 100A | 2.38B Parts By Weight |
Cure Options
2 hours @ 80°C 4 hours @ 60°C
Cured Properties
Based on cure of 2 hours @ 80°C
| Color | Black |
|---|---|
| Shore D Hardness | 90 |
| Glass Transition Temp (°C) | 100 |
| Density (g/cc) | 2.46 |
| Lap Shear 2024T3 Clad (psi) | 2,000 |
| Shrinkage Linear (%) | 0.17 |
Cured Properties
Based on cure of 4 hours @ 60°C
| Shrinkage Linear (%) | 0.04 |
|---|
Electrical Properties
Based on cure of 2 hours @ 80°C
| Dielectric Constant | 5.5 @ 100 kHz |
|---|---|
| Dissipation Factor | 0.01@ 100 kHz |
| Dielectric Strength (volts/mil) | 445 |
| Volume Resistivity (ohm-cm) | 4.0E 15@ 500 VDC |
Thermal Properties
Based on cure of 2 hours @ 80°C
| Glass Transition Temp (°C) | 100 |
|---|---|
| Degradation Temp (°C) | 300 |
| Thermal Conductivity (W/mK) | 1.26 |
Outgassing Properties
Based on cure of 2 hours @ 80°C
| TML (%) | 0.12 |
|---|---|
| CVCM (%) | 0.01 |
| WVR (%) | 0.04 |
Acoustic Properties
| Velocity (m/s) | 3,124 |
|---|---|
| Impedance (MRayles) | 7.69 |
| Loss (dB/cm-MHz) | -7.71 |
| Density (g/cc) | 2.46 |
Key Features
- D.O.T. Non-Hazardous
- Electrically Isolating
- High Glass Transition Temperature
- High Temperature Resistant
- High Thermal Conductivity
- Low Shrinkage
- Flowable
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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