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An electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. regulations.
Pot Life @ 25°C | 3 hours |
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Viscosity @ 25°C | 100,000 cPs |
Shelf Life @ -40°C | 12 Months (Cryo-Pac®) |
Shelf Life @ 25°C | 12 Months (Appli-Pac®) |
Mix Ratio | 100A:2.38B Parts By Weight |
2 hours @ 80°C 4 hours @ 60°C
Based on cure of 2 hours @ 80°C
Color | Black |
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Shore D Hardness | 90 |
Glass Transition Temp (°C) | 100 |
Density (g/cc) | 2.46 |
Lap Shear 2024T3 Clad (psi) | 2,000 |
Shrinkage Linear (%) | 0.17 |
Based on cure of 4 hours @ 60°C
Shrinkage Linear (%) | 0.04 |
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Based on cure of 2 hours @ 80°C
Dielectric Constant | 5.5 @ 100 kHz |
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Dissipation Factor | 0.01 @ 100 kHz |
Dielectric Strength (volts/mil) | 445 |
Volume Resistivity (ohm-cm) | 4.0E 15 @ 500 VDC |
Based on cure of 2 hours @ 80°C
Coefficient of Thermal Expansion, ppm/°C | Below Tg: 33; Above Tg: 103 |
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Degradation Temp (°C) | 300 |
Thermal Conductivity (W/mK) | 1.26 |
Based on cure of 2 hours @ 80°C
TML (%) | 0.12 |
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CVCM (%) | 0.01 |
WVR (%) | 0.04 |
Velocity (m/s) | 3,124 |
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Impedance (MRayles) | 7.69 |
Loss (dB/cm-MHz) | -7.71 |
Density (g/cc) | 2.46 |
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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