5316 Epoxy
1.38 W/mK
5316 is a room temperature curing, black, flowable, electrically isolating, thermally conductive epoxy. The material was designed specifically for underfilling, staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. 5316 features a long work life and is ideal for applications requiring a self-leveling, thermal conductive epoxy with resistance to solvents and chemicals. 5316 is supplied as a two-part room temperature storage kit. Contact customer service for pre-mixed and frozen options.
Uncured
| Pot Life @ 25°C | 1.5 hours |
|---|---|
| Viscosity, Mixed @ 25°C | 12,500 cPs |
| Viscosity, Part A @ 25°C | Paste |
| Viscosity, Part B @ 25°C | 250 cPs |
| Shelf Life @ 25°C | 12 Months |
| Mix Ratio | 100A:5.6B Parts By Weight |
Cure Options
24 hours @ 25°C 4 hours @ 65°C
Cured Properties
Based on cure of 24 hours @ 25°C
| Color | Black |
|---|---|
| Shore D Hardness | 85 |
| Glass Transition Temp (°C) | 55 |
| Density (g/cc) | 2.5 |
| Lap Shear 2024T3 Clad (psi) | 2,500 |
Thermal Properties
Based on cure of 24 hours @ 25°C
| Glass Transition Temp (°C) | 55 |
|---|---|
| Degradation Temp. (°C) | 300 |
| Thermal Conductivity (W/mK) | 1.38 |
Outgassing Properties
Based on cure of 4 hours @ 65°C
| TML(%) | 0.44 |
|---|---|
| CVCM(%) | 0.01 |
| WVR(%) | 0.07 |
Outgassing Properties
Based on cure of 24 hours @ 25°C
| TML(%) | 0.41 |
|---|---|
| CVCM(%) | 0.01 |
| WVR(%) | 0.07 |
Key Features
- Electrically Isolating
- High Thermal Conductivity
- Low Shrinkage
- Flowable
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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