Appli-Thane 7300 Solves Circuit Board Heat Challenge

Photo of Appli-Thane® 7300 adhesive being used for bonding a heat sink that required maximum thermal conductivity — one of many applications for this versatile material.

Situation

A company needed to redesign a circuit board in order to reduce the size and weight of the electronic components. The redesign, however, would result in higher heat generation. The old design incorporated a heat sink but with the smaller footprint and lower overall weight of the new board, a second heat sink wasn’t an option.

Solution

Most thermally conductive adhesives have a thermal conductivity of 1.25 W/mK, which was too low for the redesigned board and the high heat it would generate. The project engineer began sourcing a new adhesive and turned to Appli-Tec’s Appli-Thane® 7300.

A urethane-based, ASTM E595 adhesive, Appli-Thane 7300 met the engineer’s requirement for a 2.5 W/mK thermally conductive urethane. The adhesive met other requirements as well, including a >4 hour pot life due to being dispensed robotically.

Other required properties that Appli-Thane 7300 met included:

  • Low outgassing (ASTM E595)
  • Self-leveling consistency
  • Low tensile modulus
  • Electrically insulative
  • Hydrolytic stability

Results

Testing proved the adhesive solved the engineer’s application challenges. By incorporating Appli-Thane 7300, the engineer was able to meet the new design criteria for the board as well as ensure the new adhesive was suitable for robotic dispensing.


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