Salem, New Hampshire January 2, 2013: Appli-Tec Incorporated is pleased to announce that it has reached an agreement with Raytheon Company (NYSE: RTN) to manufacture a family of advanced Aerospace-grade adhesives based on Raytheon’s proprietary designs. These adhesive formulations will be marketed under the Appli-Thane™ brand and are specially formulated for outstanding performance in space applications and high-performance electronics assemblies.
“We are very excited to be able to offer Raytheon’s specialty adhesive solutions to companies across the aerospace, defense and high performance electronics industries,” said Tim Walsh, Appli-Tec’s president and CEO. “Raytheon is highly regarded for its industry-leading adhesive technology and commitment to customer success, which aligns well with Appli-Tec’s focus on high reliability applications, and best in class quality products and services.”
In addition to manufacturing and marketing Raytheon’s adhesives to third parties, Appli-Tec will continue to manufacture these products for Raytheon’s internal use in aerospace business applications.
“We selected Appli-Tec as our partner on this program because of their proven ability to manufacture adhesives to Raytheon’s stringent specifications,” said Paul Stovner, Raytheon’s Advanced Engineering manager. “Over a 25 year relationship with our company, Appli-Tec has consistently met our demanding expectations and demonstrated exemplary customer service.”
Appli-Tec is a leading provider of advanced adhesives, sealants and encapsulants to Fortune 500 clients in the Aerospace, Defense, Computer, Industrial, Microelectronics and Medical industries.
Founded in 1983, Appli-Tec provides full-service adhesive formulation and packaging solutions, including precision-mixed and frozen (PMF) adhesives in ready to use syringes, multi-component pouches and cartridges of non-reacted material. Appli-Tec also supports an array of specialty services that include custom materials development; cured materials casting, slicing, grinding and lapping; electronic assembly potting and encapsulation services; and cryogenic materials storage.
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