All materials are provided in the package that best meets your application needs.

appli-tec has extensive formulation capabilities. The products below can be modified to meet specific requirements. If a material that you are looking for does not appear in the following table, contact appli-tec’s technical sales department at (603) 685-0500 to discuss your particular needs. You may also fax your request to (603) 685-0236, or complete an online information request form by clicking here.

Complete Data Sheets for many products are available in Adobe Acrobat format.

Products are typically shipped with only a two-week lead-time between your order and shipping.

Denotes Adobe Acrobat file

Technical Data Sheet Description
5700 5700 is a solvent based, debondable epoxy system ideal for wafer slicing/grinding applications. Once cured 5700 forms a rigid bond until removed with a polar solvent.

 

Innovative Solutions in Adhesive Applications
7 Industrial Way, Unit 1A
Salem, NH 03079
(603) 685-0500/Fax: (603) 685-0236
service@appli-tec.com
appli-tec™, appli-pac™ and cryo-pac™ are registered trademarks of appli-tec, Inc.
© 2006. All rights reserved.