| All
materials are provided in the package that best meets your application
needs.
appli-tec
has extensive
formulation capabilities. The products below can be modified to
meet specific requirements. If a material that you are looking for
does not appear in the following table, contact appli-tec’s
technical sales
department at (603) 685-0500 to discuss your particular needs. You
may also fax your request to (603) 685-0236, or complete an online
information request form by clicking here.
Complete Data
Sheets for many products are available in Adobe Acrobat format.
Products are
typically shipped with only a two-week lead-time between your order
and shipping.
Denotes
Adobe Acrobat file
| Technical
Data Sheet |
Description |
5700 |
5700
is a solvent based, debondable epoxy system ideal for wafer
slicing/grinding applications. Once cured 5700 forms a rigid
bond until removed with a polar solvent. |
|