| Technical
Data Sheet |
Description |
|
0107 is a high temperature, humidity resistant, two part epoxy system. It is useful in many environments for mechanical, electrical and electronic applications. |
0931 |
0931 is a black version of our 0832 epoxy compound. This material is ideal for use in blocking light transmission. 0931 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics. |
0832 |
0832
is an optically clear epoxy compound. This material is ideal
for use in applications in which light transmission is essential.
0832 features a long work life and low viscosity, which makes
it easy to work with. The low viscosity and Newtonian behavior
allow this material to easily wick into tight
areas. This material bonds well to metals, glass, ceramics and most plastics. |
5055 |
5055
is an improved version of 5051 optically clear epoxy adhesive.
This adhesive is ideal for use in applications in which light
transmission is essential. 5055 features a long work life
and low viscosity, which makes it easy to work with. The
low viscosity and Newtonian behavior allow this material
to easily wick into tight areas. This material bonds well
to metals, glass, ceramics and most plastics. |
5106 |
This
two component, room temperature curing epoxy encapsulation/potting
compound is specifically designed for potting electronic
components. 5106 will not stress sensitive components and
was designed to withstand reflow conditions. 5106 exhibits
controlled flow properties and will not flow underneath boards
or into undesirable places. |
5116 |
The
two-component, room temperature curing, epoxy compound described
in this data sheet is specifically designed for adhering
dissimiliar materials. 5116 exhibits controlled flow properties
and will not flow underneath boards or into undesirable places,
ideal for use in damming applications. |
5203 |
This
conductive adhesive offers electrostatic discharge (ESD)
protection. This adhesive provides excellent conductivity
when applied as a bead, dot or when sandwhiched between substrates.The
two component 5 - minute epoxy is a 100% solids formulation
that offers fast curing and high strength. This is an ideal
material when quick defixturing is necessary. |
5315 |
This
two component, thermally conductive, epoxy compound is designed
for encapsulating power supplies, transformers and coils.
Adhesive 5315 features a long work life, excellent electrical
insulating properties and has superior resistance to solvents
and chemicals. This material is also environmentally friendly
and is not hazardous per DOT regulations. |
5400 |
This
two component, 100% solids, fast curing, high strength, 5
minute epoxy is the ideal material when quick defixturing
is necessary. Unlike many other fast curing epoxy materials,
the 5400 formula does not become brittle with age. This is
a 100% solids adhesive. A perfect choice when a high strength,
fast curing adhesive is needed. This adhesive can be made
into various paste forms. |
5402 |
This
two component, 100% solids, fast curing black epoxy is used
for coating circuit boards as a protective coating and used
for quick bonding of dissimilar substraights. Unlike many
other fast curing epoxy materials, the 5402 formula does
not become brittle with age. A perfect choice when a high
strength, fast curing coating or bonding adhesive is needed.
This adhesive is black and slightly thixotropic. |
5432 |
This
two component 8 minute epoxy is the ideal material when rapid
bonding and/or quick defixturing is necessary. Adheres well
to dissimilar materials including concrete and metals. Unlike
many other fast curing epoxy materials, 5432 remains tough
with age. This 100% solids adhesive is a perfect choice when
a high strength, fast curing adhesive is needed. 5432 is
UV resistant making it the ideal choice for outdoor applications. |
6001 |
6001
is specifically designed to instantly cure under UV light,
then rapidly room temperature cure to a cross-linked state
in shadowed areas. Heat sensitive parts can now be rapidly
bonded without the worry of uncured adhesive leaching onto
critical components. Cure in shadowed areas enhances the
mechanical properties of this adhesive. |
6004 |
6004
is low out-gassing, UV/Heat curable adhesive, which forms
high strength bonds to metals, ceramic, glass and most plastics.
6004 exhibits high shear and peel strength. This adhesive
will aggressively bond with exposure to UV light and will
cure in shadowed areas with the application of heat. This
unique curing mechanism is ideal when rapid de-fixturing
is required. |
C6004LV |
C6004LV
is a thixotropic, UV curable adhesive, which forms high
strength bonds to metals, ceramic, glass and most plastics.
C6004LV exhibits high shear strength. This adhesive will
aggressively bond with exposure to UV light. This curing
mechanism is ideal when rapid bonding and de-fixturing
is required. C6004LV is designed to be used for the assembly
of HGA’s, wire tacking, and in any other application
requiring high strength bonding. |
6006 |
6006
is specifically designed to instantly tack cure in areas
exposed to UV light, then rapidly room temperature cure to
a crosslinked state in shadowed areas. Heat sensitive parts
can now be rapidly bonded without the worry of uncured adhesive
leaching onto critical components. Cure in shadowed areas
enhances the mechanical properties of this adhesive. |
6051 |
A
dual cure adhesive ideal for bonding metallic substrates
to each other when there is an exposed bond line. UV tacking
provides firm strong bonds which allow parts to be immediately
defixtured. Exposure to heat cures shadowed areas and enhances
bond strength. |
6103 |
6103
is an acrylated polyurethane adhesive specifically designed
to encapsulate/coat fiber optic cables. This adhesive instantly
cures under UV light. 6103 has been specially formulated
to release from glass. This allows glass fixturing and cover
plates to be used. Glass allows for easy quality control
during processing and makes uniform and repeatable surfaces
possible. Bonds well to plastics. |
6105 |
This
adhesive was specifically designed to bond PCB’s to plastic substrates. The thixotropic
nature of this product allows it to flow freely during dispensing
yet remain nonsagging after application. UV light allows “instant” cure
for increased product throughput. |
6110 |
6110
is a medium thixotropic, UV curable adhesive, which forms
high strength bondsmto metals, ceramic, glass and most plastics.
6110 exhibits high shear strength. This adhesive will aggressively
bond with exposure to UV light. This curing mechanism is
ideal when rapid bonding and de-fixturing is required. 6110
is designed to be used for the assembly of HGA’s, wire
tacking, headphone assembly and in any other application
requiring high strength bonding. |
6207 |
6207
is a filled 100% solids, low out-gassing, UV/Heat curable
adhesive, which forms high strength bonds to metals, ceramic,
glass and most plastics. This adhesive will aggressively
bond with exposure to UV light and will cure in areas unexposed
to UV with the application of heat. This unique curing mechanism
is ideal when rapid de-fixturing is required. 6207 is design
to be used for the assembly application requiring low out-gassing
and high cleanliness. |
9100 |
This
room temperature curing polysulfide is designed for use on
integral fuel tanks and pressurized cabins as well as other
areas subject to contact with aircraft fuels, lubricants,
oils, water and/or weathering. This product is certified
to MIL-S-8802F Type II. |
9200 |
This
one component pre-mixed and frozen adhesive insures a proper
mix ratio, complete mixing and air free bond every time.
Alternatively, this adhesive is offered in a two-component
pre-weighed and ready-to-use package, which insures the proper
amount of part (A)/(B) are mixed every time. Material is
mixed in the tough sealed package with out making a mess.
This package is ideal for field use applications. It is a
room temperature curing polysulfide and designed for use
where both flexibility and solvent/moisture resistance are
required. This material is AMS-S-8802, TY II, Class A-2 certified. |