All materials are provided in the package that best meets your application needs.

appli-tec has extensive formulation capabilities. The products below can be modified to meet specific requirements. If a material that you are looking for does not appear in the following table, contact appli-tec’s technical sales department at (603) 685-0500 to discuss your particular needs. You may also fax your request to (603) 685-0236, or complete an online information request form by clicking here.

Complete Data Sheets for many products are available in Adobe Acrobat format.

Products are typically shipped with only a two-week lead-time between your order and shipping.

Denotes Adobe Acrobat file

Technical Data Sheet	Description
0107	0107 is a high temperature, humidity resistant, two part epoxy system. It is useful in many environments for mechanical, electrical and electronic applications.
0523	0523 is a high strength, high temperature, humidity resistant, one-component polyimid adhesive. It is useful in many environments for mechanical, electrical and electronic applications. The material is a viscous liquid at room temperature and can be dispensed as a viscous liquid from the standard syringe package or heated to significantly lower viscosity and ease application. 0523 is shipped in refrigerated, sealed packages and is fully tested and certified in it’s final, ready to use form.
0832	0832 is an optically clear epoxy compound. This material is ideal for use in applications in which light transmission is essential. 0832 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics.
0931	0931 is a black version of our 0832 epoxy compound. This material is ideal for use in blocking light transmission. 0931 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics.
5010	This heat curing epoxy compound was developed to provide a long potlife and low outgassing. This material has been designed to have a high glass transition temperature to optimize performance at high operating temperatures.
5010 tc1	This material is a free flowing, thermally conductive version of our 5010 epoxy. 5010-TC1, which has a very high glass transition temperature. The high glass transition temperature optimizes performance at elevated temperatures while the thermal conductivity helps to dissipate heat. 5010-TC1 is recommended for bonding glass, ceramics and metals.
5010 tc6	This material is a controlled flow, thermally conductive version of our 5010 epoxy. 5010-TC6 resists sag during cure and has a very high glass transition temperature. The high glass transition temperature optimizes performance at elevated temperatures while the thermal conductivity helps to dissipate heat. 5010- TC6 is recommended for bonding glass, ceramics and metals.
5055	5055 is an improved version of 5051 optically clear epoxy adhesive. This adhesive is ideal for use in applications in which light transmission is essential. 5055 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics.
5101	This two component, room temperature curing epoxy compound is specifically designed for the bonding of dissimilar materials and wicking into tight interfaces.
5102	This two component, room temperature curing, flexible epoxy compound is designed for bonding glass to plastics, metals, and other structural materials.
5105	This two component, room temperature curing epoxy encapsulant/potting compound is specifically designed to not stress sensitive components and to withstand reflow conditions. 5105 is a low viscosity, free flowing material that will self-level and fill-in gaps.
5106	This two component, room temperature curing epoxy encapsulation/potting compound is specifically designed for potting electronic components. 5106 will not stress sensitive components and was designed to withstand reflow conditions. 5106 exhibits controlled flow properties and will not flow underneath boards or into undesirable places.
5116	The two-component, room temperature curing, epoxy compound described in this data sheet is specifically designed for adhering dissimiliar materials. 5116 exhibits controlled flow properties and will not flow underneath boards or into undesirable places, ideal for use in damming applications.
5200	This two component, room temperature curing electrically conductive epoxy compound is specifically designed for the bonding of materials where electrical conductivity is required and where high temperature processing can not be tolerated. This silver containing adhesive is designed for applications such as electrical bonding, EMI shielding, room temperature soldering and other applications requiring excellent thermal and electrical conductivity across the bond line.
5203	This conductive adhesive offers electrostatic discharge (ESD) protection. This adhesive provides excellent conductivity when applied as a bead, dot or when sandwhiched between substrates.The two component 5 - minute epoxy is a 100% solids formulation that offers fast curing and high strength. This is an ideal material when quick defixturing is necessary.
5301	This two component or pre-mixed frozen, room temperature curing, thermally conductive epoxy compound is designed for encapsulating power supplies, transformers and coils. Adhesive 5301 is ideal for applications that require a low temperature cure. Bonds well to most; plastic, glass and metal.
5310	This two component, thermally conductive, epoxy compound is designed for encapsulating power supplies, transformers and coils. Adhesive 5310 features a long work life, excellent electrical insulating properties and has superior resistance to solvents and chemicals.
5315	This two component, thermally conductive, epoxy compound is designed for encapsulating power supplies, transformers and coils. Adhesive 5315 features a long work life, excellent electrical insulating properties and has superior resistance to solvents and chemicals. This material is also environmentally friendly and is not hazardous per DOT regulations.
5402	This two component, 100% solids, fast curing black epoxy is used for coating circuit boards as a protective coating and used for quick bonding of dissimilar substraights. Unlike many other fast curing epoxy materials, the 5402 formula does not become brittle with age. A perfect choice when a high strength, fast curing coating or bonding adhesive is needed. This adhesive is black and slightly thixotropic.
5450	This two component epoxy compound is specifically designed for bonding of dissimilar materials and wicking into tight interfaces. 5450 bonds well to many substrates such as thermoplastics, ceramics, metals, and composite materials. This material is ideally suited for bonding ferrite parts where there is no resulting loss of inductance over the bonded interface.
5502	This two-component, electrically conductive epoxy is designed for bonding dissimilar conductive materials. Although made for metal bonding this adhesive bonds well to most plastics. The high strength and toughness of this adhesive make it ideal for structural applications that are subjected to temperature extremes. This material will aggresively tack when heated to 120°C for 3 minutes. This offers the advantage of rapid defixturing. Full cure occurs upon subsequent heating.
C6004LV	C6004LV is a thixotropic, UV curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. C6004LV exhibits high shear strength. This adhesive will aggressively bond with exposure to UV light. This curing mechanism is ideal when rapid bonding and de-fixturing is required. C6004LV is designed to be used for the assembly of HGA’s, wire tacking, and in any other application requiring high strength bonding.
6001	6001 is specifically designed to instantly cure under UV light, then rapidly room temperature cure to a cross-linked state in shadowed areas. Heat sensitive parts can now be rapidly bonded without the worry of uncured adhesive leaching onto critical components. Cure in shadowed areas enhances the mechanical properties of this adhesive.
6004	6004 is low out-gassing, UV/Heat curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. 6004 exhibits high shear and peel strength. This adhesive will aggressively bond with exposure to UV light and will cure in shadowed areas with the application of heat. This unique curing mechanism is ideal when rapid de-fixturing is required.
6006	6006 is specifically designed to instantly tack cure in areas exposed to UV light, then rapidly room temperature cure to a crosslinked state in shadowed areas. Heat sensitive parts can now be rapidly bonded without the worry of uncured adhesive leaching onto critical components. Cure in shadowed areas enhances the mechanical properties of this adhesive.
6007	6007 is a 100% solids, low out-gassing, UV/Heat curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. 6007 exhibits high shear and peel strength. This adhesive will aggressively bond with exposure to UV light and will cure in areas unexposed to UV with the application of heat. This unique curing mechanism is ideal when rapid de-fixturing is required.
6008	This clear UV urethane acrylate adhesive is extremely soft and flexible. It is ideal for tacking sensitive components that require strain relief. UV cure provides high production rates. This adhesive has found use in fiber optic applications.
6110	6110 is a medium thixotropic, UV curable adhesive, which forms high strength bondsmto metals, ceramic, glass and most plastics. 6110 exhibits high shear strength. This adhesive will aggressively bond with exposure to UV light. This curing mechanism is ideal when rapid bonding and de-fixturing is required. 6110 is designed to be used for the assembly of HGA’s, wire tacking, headphone assembly and in any other application requiring high strength bonding.
6051	A dual cure adhesive ideal for bonding metallic substrates to each other when there is an exposed bond line. UV tacking provides firm strong bonds which allow parts to be immediately defixtured. Exposure to heat cures shadowed areas and enhances bond strength.
6103	6103 is an acrylated polyurethane adhesive specifically designed to encapsulate/coat fiber optic cables. This adhesive instantly cures under UV light. 6103 has been specially formulated to release from glass. This allows glass fixturing and cover plates to be used. Glass allows for easy quality control during processing and makes uniform and repeatable surfaces possible. Bonds well to plastics.
6200	This dual-cure adhesive is designed for bonding glass,ceramics, metals and plastics. 6200 offers fast UV tacking of components and has been optimized to enhance UV penetration. Shadowed areas may be cured thermally.
6202	6202 is specifically designed for applications where thermal conductivity is essential. This high strength adhesive rapidly tacks parts in place when exposed to UV light. Maximum strength and shadow cure are achieved after application of heat.
6207	6207 is a filled 100% solids, low out-gassing, UV/Heat curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. This adhesive will aggressively bond with exposure to UV light and will cure in areas unexposed to UV with the application of heat. This unique curing mechanism is ideal when rapid de-fixturing is required. 6207 is design to be used for the assembly application requiring low out-gassing and high cleanliness.