All materials are provided in the package that best meets your application needs.

appli-tec has extensive formulation capabilities. The products below can be modified to meet specific requirements. If a material that you are looking for does not appear in the following table, contact appli-tec’s technical sales department at (603) 685-0500 to discuss your particular needs. You may also fax your request to (603) 685-0236, or complete an online information request form by clicking here.

Complete Data Sheets for many products are available in Adobe Acrobat format.

Products are typically shipped with only a two-week lead-time between your order and shipping.

Denotes Adobe Acrobat file

Technical Data Sheet	Description
0107	0107 is a high temperature, humidity resistant, two part epoxy system. It is useful in many environments for mechanical, electrical and electronic applications.
0931	0931 is a black version of our 0832 epoxy compound. This material is ideal for use in blocking light transmission. 0931 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics.
5010 tc1	This material is a free flowing, thermally conductive version of our 5010 epoxy. 5010-TC1, which has a very high glass transition temperature. The high glass transition temperature optimizes performance at elevated temperatures while the thermal conductivity helps to dissipate heat. 5010-TC1 is recommended for bonding glass, ceramics and metals.
5010 tc6	This material is a controlled flow, thermally conductive version of our 5010 epoxy. 5010-TC6 resists sag during cure and has a very high glass transition temperature. The high glass transition temperature optimizes performance at elevated temperatures while the thermal conductivity helps to dissipate heat. 5010- TC6 is recommended for bonding glass, ceramics and metals.
5105	This two component, room temperature curing epoxy encapsulant/potting compound is specifically designed to not stress sensitive components and to withstand reflow conditions. 5105 is a low viscosity, free flowing material that will self-level and fill-in gaps.
5106	This two component, room temperature curing epoxy encapsulation/potting compound is specifically designed for potting electronic components. 5106 will not stress sensitive components and was designed to withstand reflow conditions. 5106 exhibits controlled flow properties and will not flow underneath boards or into undesirable places.
5116	The two-component, room temperature curing, epoxy compound described in this data sheet is specifically designed for adhering dissimiliar materials. 5116 exhibits controlled flow properties and will not flow underneath boards or into undesirable places, ideal for use in damming applications.
5301	This two component or pre-mixed frozen, room temperature curing, thermally conductive epoxy compound is designed for encapsulating power supplies, transformers and coils. Adhesive 5301 is ideal for applications that require a low temperature cure. Bonds well to most; plastic, glass and metal.
5310	This two component, thermally conductive, epoxy compound is designed for encapsulating power supplies, transformers and coils. Adhesive 5310 features a long work life, excellent electrical insulating properties and has superior resistance to solvents and chemicals.
7100	7100 is a two-component, flexible polyurethane system, which is used for potting sensitive electrical and electronic components. This material has excellent moisture resistance and maintains outstanding electrical properties up to 150oC
7101	7101 is a two component, low viscosity, polyurethane potting and molding compound. This material is ideal for cable and connector potting and molding or where ever high tear strength and fast cure are required. This material was formulated to be environmentally friendly with low toxicity.
7107	7107 is a two component polyurethane potting and molding compound. This material is ideal for cable and connector potting and molding or where ever high tear strength is required. This material was formulated to environmentally friendly with low toxicity.
7500	7500 is a two component, ozone resistant, polyurethane potting and molding compound. This material is ideal for cable and connector potting and molding or where ever a water-tight seal is required.
8800	Appli-tec 8800 is an addition cured silicone potting compound designed to provide environmental protection to electronic components. 8800 has a convenient 1:1 (by weight / by volume) mix ratio. The low viscosity of this product allows trapped air to escape from potted parts. 8800 is flexible when cured and provides components with protection from jarring impacts. The clear break-a-way material makes it easy to locate and repair components should rework be necessary.