All materials are provided in the package that best meets your application needs.

appli-tec has extensive formulation capabilities. The products below can be modified to meet specific requirements. If a material that you are looking for does not appear in the following table, contact appli-tec’s technical sales department at (603) 685-0500 to discuss your particular needs. You may also fax your request to (603) 685-0236, or complete an online information request form by clicking here.

Complete Data Sheets for many products are available in Adobe Acrobat format.

Products are typically shipped with only a two-week lead-time between your order and shipping.

Denotes Adobe Acrobat file

Technical Data Sheet	Description
0107	0107 is a high temperature, humidity resistant, two part epoxy system. It is useful in many environments for mechanical, electrical and electronic applications.
0523	0523 is a high strength, high temperature, humidity resistant, one-component polyimid adhesive. It is useful in many environments for mechanical, electrical and electronic applications. The material is a viscous liquid at room temperature and can be dispensed as a viscous liquid from the standard syringe package or heated to significantly lower viscosity and ease application. 0523 is shipped in refrigerated, sealed packages and is fully tested and certified in it’s final, ready to use form.
0931	0931 is a black version of our 0832 epoxy compound. This material is ideal for use in blocking light transmission. 0931 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics.
5010	This heat curing epoxy compound was developed to provide a long potlife and low outgassing. This material has been designed to have a high glass transition temperature to optimize performance at high operating temperatures.
5051	5051 is an optically clear epoxy adhesive. This adhesive is ideal for use in applications in which light transmission is essential. 5051 features a long work life and low viscosity, which makes it easy to work with. The low viscosity and Newtonian behavior allow this material to easily wick into tight areas. This material bonds well to metals, glass, ceramics and most plastics.
5101	This two component, room temperature curing epoxy compound is specifically designed for the bonding of dissimilar materials and wicking into tight interfaces.
5102	This two component, room temperature curing, flexible epoxy compound is designed for bonding glass to plastics, metals, and other structural materials.
5105	This two component, room temperature curing epoxy encapsulant/potting compound is specifically designed to not stress sensitive components and to withstand reflow conditions. 5105 is a low viscosity, free flowing material that will self-level and fill-in gaps.
5106	This two component, room temperature curing epoxy encapsulation/potting compound is specifically designed for potting electronic components. 5106 will not stress sensitive components and was designed to withstand reflow conditions. 5106 exhibits controlled flow properties and will not flow underneath boards or into undesirable places.
5116	The two-component, room temperature curing, epoxy compound described in this data sheet is specifically designed for adhering dissimiliar materials. 5116 exhibits controlled flow properties and will not flow underneath boards or into undesirable places, ideal for use in damming applications.
5400	This two component, 100% solids, fast curing, high strength, 5 minute epoxy is the ideal material when quick defixturing is necessary. Unlike many other fast curing epoxy materials, the 5400 formula does not become brittle with age. This is a 100% solids adhesive. A perfect choice when a high strength, fast curing adhesive is needed. This adhesive can be made into various paste forms.
5402	This two component, 100% solids, fast curing black epoxy is used for coating circuit boards as a protective coating and used for quick bonding of dissimilar substraights. Unlike many other fast curing epoxy materials, the 5402 formula does not become brittle with age. A perfect choice when a high strength, fast curing coating or bonding adhesive is needed. This adhesive is black and slightly thixotropic.
5432	This two component 8 minute epoxy is the ideal material when rapid bonding and/or quick defixturing is necessary. Adheres well to dissimilar materials including concrete and metals. Unlike many other fast curing epoxy materials, 5432 remains tough with age. This 100% solids adhesive is a perfect choice when a high strength, fast curing adhesive is needed. 5432 is UV resistant making it the ideal choice for outdoor applications.
5450	This two component epoxy compound is specifically designed for bonding of dissimilar materials and wicking into tight interfaces. 5450 bonds well to many substrates such as thermoplastics, ceramics, metals, and composite materials. This material is ideally suited for bonding ferrite parts where there is no resulting loss of inductance over the bonded interface.
5502	This two-component, electrically conductive epoxy is designed for bonding dissimilar conductive materials. Although made for metal bonding this adhesive bonds well to most plastics. The high strength and toughness of this adhesive make it ideal for structural applications that are subjected to temperature extremes. This material will aggresively tack when heated to 120°C for 3 minutes. This offers the advantage of rapid defixturing. Full cure occurs upon subsequent heating.
6001	6001 is specifically designed to instantly cure under UV light, then rapidly room temperature cure to a cross-linked state in shadowed areas. Heat sensitive parts can now be rapidly bonded without the worry of uncured adhesive leaching onto critical components. Cure in shadowed areas enhances the mechanical properties of this adhesive
6004	6004 is low out-gassing, UV/Heat curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. 6004 exhibits high shear and peel strength. This adhesive will aggressively bond with exposure to UV light and will cure in shadowed areas with the application of heat. This unique curing mechanism is ideal when rapid de-fixturing is required.
6006	6006 is specifically designed to instantly tack cure in areas exposed to UV light, then rapidly room temperature cure to a crosslinked state in shadowed areas. Heat sensitive parts can now be rapidly bonded without the worry of uncured adhesive leaching onto critical components. Cure in shadowed areas enhances the mechanical properties of this adhesive.
6007	6007 is a 100% solids, low out-gassing, UV/Heat curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. 6007 exhibits high shear and peel strength. This adhesive will aggressively bond with exposure to UV light and will cure in areas unexposed to UV with the application of heat. This unique curing mechanism is ideal when rapid de-fixturing is required
6051	A dual cure adhesive ideal for bonding metallic substrates to each other when there is an exposed bond line. UV tacking provides firm strong bonds which allow parts to be immediately defixtured. Exposure to heat cures shadowed areas and enhances bond strength.
6110	6110 is a medium thixotropic, UV curable adhesive, which forms high strength bondsmto metals, ceramic, glass and most plastics. 6110 exhibits high shear strength. This adhesive will aggressively bond with exposure to UV light. This curing mechanism is ideal when rapid bonding and de-fixturing is required. 6110 is designed to be used for the assembly of HGA’s, wire tacking, headphone assembly and in any other application requiring high strength bonding.
6207	6207 is a filled 100% solids, low out-gassing, UV/Heat curable adhesive, which forms high strength bonds to metals, ceramic, glass and most plastics. This adhesive will aggressively bond with exposure to UV light and will cure in areas unexposed to UV with the application of heat. This unique curing mechanism is ideal when rapid de-fixturing is required. 6207 is design to be used for the assembly application requiring low out-gassing and high cleanliness.
9100	This room temperature curing polysulfide is designed for use on integral fuel tanks and pressurized cabins as well as other areas subject to contact with aircraft fuels, lubricants, oils, water and/or weathering. This product is certified to MIL-S-8802F Type II.
9200	This one component pre-mixed and frozen adhesive insures a proper mix ratio, complete mixing and air free bond every time. Alternatively, this adhesive is offered in a two-component pre-weighed and ready-to-use package, which insures the proper amount of part (A)/(B) are mixed every time. Material is mixed in the tough sealed package with out making a mess. This package is ideal for field use applications. It is a room temperature curing polysulfide and designed for use where both flexibility and solvent/moisture resistance are required. This material is AMS-S-8802, TY II, Class A-2 certified.