appli-tec packages materials that have been approved by NASA for space flight conditions and meeting NASA’s outgassing requirements. Material Certification is available upon request. appli-tec’s unique processes maximize potlife, preserve quality and facilitate smooth and consistent application. All materials are provided in the package that best meets your application needs.

appli-tec has extensive formulation capabilities, The products below can be modified to meet specific requirements. If a material that you are looking for does not appear in the following table, contact appli-tec’s technical sales department at (603) 685-0500 to discuss your particular needs. You may also fax you request to (603) 685-0236, or complete an online information request form by clicking here.

Complete Data Sheets for many products are available in Adobe Acrobat format.

Products are typically shipped with only a two-week lead-time between your order and shipping.

Denotes Adobe Acrobat file

Technical Data Sheet	Description
NASA 1 NASA 2	NASA Approved Materials
5010	This heat curing epoxy compound was developed to provide a long potlife and low outgassing. This material has been designed to have a high glass transition temperature to optimize performance at high operating temperatures.
5010 tc6	This material is a controlled flow, thermally conductive version of our 5010 epoxy. 5010-TC6 resists sag during cure and has a very high glass transition temperature. The high glass transition temperature optimizes performance at elevated temperatures while the thermal conductivity helps to dissipate heat. 5010- TC6 is recommended for bonding glass, ceramics and metals.
5200	This two component, room temperature curing electrically conductive epoxy compound is specifically designed for the bonding of materials where electrical conductivity is required and where high temperature processing can not be tolerated. This silver containing adhesive is designed for applications such as electrical bonding, EMI shielding, room temperature soldering and other applications requiring excellent thermal and electrical conductivity across the bond line.
6202	6202-LO is specifically designed for applications where thermal conductivity is essential. This high strength adhesive rapidly tacks parts in place when exposed to UV light. Maximum strength and shadow cure are achieved after application of heat.